Samsung Electro-mechanics Co., Ltd.

Soon-Oh Jung

Jee-Soo Mok

Young-Gwan Ko

Yong-Ho Baek

Kyung-Hwan Ko

Jae-Ean Lee

Seok-Kyu Lee

Shuhichi Okabe

Jong-Kuk Hong

Jin-Yong An

Hae-Nam Seo

A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.

Printed circuit board with dam around cavity and manufacturing method thereof

A printed circuit board includes: an insulating layer including a cavity formed therein, the cavity being recessed into the insulating layer from a top surface of the insulating layer; a first circuit layer formed inside the insulating layer such that a portion of the first circuit layer is disposed within the cavity; a second circuit layer disposed above the insulating layer; a first surface-treated layer disposed above the portion of the first circuit layer disposed within the cavity; and a second surface-treated layer disposed above the second circuit layer.

Printed circuit board and method of manufacturing the same

A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

Method of manufacturing printed circuit board

Growing community of inventors

Yongin-si, South Korea

Soon-Oh Jung