Samsung Electronics Co., Ltd.

Soon Moon Jung

Joo Young Kim

Jae Duk Lee

Jung Dal Choi

Sung Bong Kim

In a method of programming a non-volatile memory device, a first voltage is applied to a selected word line corresponding to a selected memory cell transistor of a selected transistor string to be programmed; a second voltage is applied to a neighboring word line neighboring the selected word line and corresponding to a neighboring transistor of the selected transistor string, wherein the first voltage is greater than the second voltage, the application of the first and second voltages to the selected and neighboring word lines respectively causing electrons to be generated by an electric field formed between the neighboring transistor and the selected memory cell transistor, the electrons accelerating toward the selected memory cell transistor and injecting into a charge storage layer of the selected memory cell transistor; wherein the neighboring transistor is positioned between the selected memory cell transistor and one of a ground select transistor and a string select transistor, and the first voltage is applied to unselected word lines corresponding to unselected memory cell transistors of the selected transistor string positioned between the selected memory cell transistor and the other of the ground select transistor and the string select transistor.

Methods of programming non-volatile flash memory devices by applying a higher voltage level to a selected word line than to a word line neighboring the selected word line

A method of forming contact holes of a semiconductor device wherein process yield is improved and manufacturing processes can be simplified. First, a plurality of gate electrodes provided with a plurality of spacers are formed on an active region of a semiconductor substrate that is separated into the active region and a field region by a field oxide layer. Then, the outermost spacers are removed from the plurality of spacers, to ensure a space for a first contact hole on the semiconductor substrate. Next, an etch stopping layer and an interlayer dielectric are subsequently formed on the semiconductor substrate. By etching the interlayer dielectric and the etch stopping layer subsequently, the first contact hole is formed by exposing a first surface of the semiconductor substrate between the gate electrodes and a second contact hole is formed by exposing a second surface of the semiconductor substrate which includes a portion of a surface of the field oxide layer and a portion of the semiconductor substrate near the field oxide layer, simultaneously. A manufacturing process of the semiconductor device can thus be simplified by forming contact holes simultaneously, using a self aligned contact method in which a first contact hole is formed by using a plurality of spacers and using a borderless contact method in which the second contact hole is formed from a side portion of the gate electrode to a portion of a field region.

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Seongnam-shi, South Korea

Soon Moon Jung