Macom Technology Solutions Holdings, Inc.

Wolfspeed, Inc.

Infineon Technologies Ag

Soon Lee Liew

Alexander Komposch

Eng Wah Woo

Kok Meng Kam

Chau Fatt Chiang

Kok Yau Chua

Stefan Helmut Schmalzl

Werner Josef Reiss

Chee Hong Lee

Hock Heng Chong

Nurfarena Othman

Hsieh Ting Kuek

Pei Luan Pok

Roslie Saini Bin Bakar

Junny Abdul Wahid

Samantha Cheang

Kon Hoe Chin

April Coleen Tuazon Bernardez

A semiconductor device package includes an interconnect structure with a first surface having at least one die thereon and a second surface that is opposite the first surface and is configured to be coupled to an external device. A protective structure on the first surface of the interconnect structure exposes a heat dissipating surface facing away from the interconnect structure in one or more directions. Related devices and fabrication methods are also discussed.

Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the same

A leadframe blank includes a first package blank, a second package blank and a tie bar between the first package blank and the second package blank. The tie bar includes a recessed cavity therein.

Packaged semiconductor devices with leadframes having tie bar with recessed cavity

A package mold according to some embodiments includes a first mold body and a second mold body, a mold cavity in the first mold body, a gate in a first side of the mold cavity for supplying liquid mold compound into the mold cavity, a longitudinal vent for releasing gas from the mold cavity in a second side of the mold cavity opposite the first side of the mold cavity, and a transverse vent for releasing gas from the mold cavity in a third side of the mold cavity that extends between the first and second sides of the mold cavity. Methods of packaging an electronic device using the package mold and resulting packaged devices are also disclosed.

Packaged semiconductor devices, and package molds for forming packaged semiconductor devices

A method of forming a packaged semiconductor device according to some embodiments includes providing a leadframe blank including a first package blank, a second package blank and a tie bar between the first package blank and the second package blank, forming a recessed cavity in the tie bar, and separating the first and second package blanks by sawing through the leadframe blank along the tie bar.

Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages

Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.

Semiconductor package with air cavity

Growing community of inventors

Ipoh, Malaysia

Soon Lee Liew