Samsung Electro-mechanics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Soon Ju Lee

Heung Kil Park

Sang Soo Park

Young Ghyu Ahn

Kyoung Jin Jun

Byoung Hwa Lee

So Yeon Song

Seok Kyoon Woo

Min Cheol Park

Soo Hwan Son

Kyo Kwang Lee

Hyun Tae Kim

Young Key Kim

Seung Hyun Ra

Hwi Geun Im

Dae Hyung Yun

Su Jung Kim

A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

Laminated electronic component and circuit board for mounting the same

A multilayer ceramic electronic component and a board having the same are provided. The multilayer ceramic electronic component includes a multilayer ceramic capacitor including external electrodes including front portions and band portions extended from the front portions, terminal electrodes respectively surrounding the front portions and portions of lower surfaces of the band portions of the external electrodes and respectively having a '' shaped groove portion formed in lower portions thereof, and conductive adhesive layers connecting the external electrodes and the terminal electrodes to each other.

Multilayer ceramic electronic component and board having the same

A multilayer ceramic capacitor (MLCC) includes: first and second metal frames formed on a mounting surface of a ceramic body to be connected to first and second external electrodes providing voltages having opposing polarities, respectively, wherein the first and second metal frames are positioned inwardly of both end surfaces of the ceramic body in a length direction of the ceramic body to be spaced apart from both end surfaces of the ceramic body, respectively.

Multilayer ceramic capacitor and board having the same

A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes having respective dielectric layers interposed therebetween, and first and second external electrodes respectively including first and second connection portions, and first and second band portions extended from the first and second connection portions, and first and second metal frames respectively including first and second upper horizontal portions, first and second lower horizontal portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions, respectively.

Multilayer ceramic component having metal frames connected to external electrodes thereof and board having the same

There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor (MLCC) including first and second external electrodes disposed to be spaced apart from one another on a mounting surface thereof; and first and second terminal electrodes including upper horizontal portions disposed on lower surfaces of the first and second external electrodes, lower horizontal portions disposed to be spaced apart from the upper horizontal portions downwardly, and curved vertical portions connecting one ends of the upper horizontal portions and one ends of the lower horizontal portions, having '&#x2282;' and '&#x2283;' shapes, and disposed on the mounting surface of the MLCC in a facing manner.

A multilayer ceramic component including a multilayer ceramic capacitor including first and second external electrodes disposed on a mounting surface of a ceramic body; and first and second terminal electrodes each including an upper horizontal part disposed on a lower surface of the respective external electrode, a lower horizontal part disposed below the upper horizontal part and spaced apart from the upper horizontal part, and a connecting part connecting the upper horizontal part and the lower horizontal part, the connecting part having a plurality of openings alternately facing opposite end surfaces of the ceramic body.

Multilayer ceramic component and board having the same

There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.

Chip electronic component and board having the same

An electronic component and a board having the same are provided. The electronic component according to an exemplary embodiment in the present disclosure may include a body having upper and lower surfaces, first and second side surfaces, and third and fourth side surfaces; external electrodes disposed on at least one of the upper and lower surfaces and the third and fourth side surfaces of the body; and connection terminals disposed on the external electrodes, wherein the connection terminals are disposed inwardly to be spaced apart from an edge of a surface of the body on which the connection terminals are disposed.

Electronic component and board having the same

There are provided an interposer, an electronic component including the same, and a board having an electronic component including the same and the interposer may include an insulating board, connective electrodes disposed on the insulating board, a concave part disposed so that when a length of a region including the insulating board and the connective electrodes is defined as L and a width thereof is defined as W, an area of the region including the insulating board and the connective electrodes on a first main surface is smaller than L&#xd7;W.

Interposer, electronic component including the same, and board having electronic component including the same

A multilayer ceramic electronic component may include: a ceramic body in which a plurality of internal electrodes and a plurality of dielectric layers are stacked in a thickness direction; and an external electrode including an electrode layer disposed on an outer surface of the ceramic body to be connected to the internal electrodes, a conductive resin layer disposed on the electrode layer and containing metal particles and a base resin, and a plating layer disposed on the conductive resin layer.

Multilayer ceramic electronic component

A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes facing each other with one dielectric layer therebetween and alternately exposed to the first or second side surface; upper and lower cover layers disposed on and below the active layer; and a first external electrode disposed on the first side surface and a second external electrode disposed on the second side surface. Thickness T and width W of the ceramic body satisfy 0.75W&#x2266;T&#x2266;1.25W, gap G between the first and second external electrodes satisfies 30 &#x3bc;m&#x2266;G&#x2266;0.9W, and an average number of dielectric grains in a single dielectric layer in a thickness direction thereof is 2 or greater.

Multilayer ceramic capacitor and board having the same mounted thereon

A mounting circuit board of a multilayer ceramic capacitor includes a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween, and first and second external electrodes extended from both end surfaces of the ceramic body to a portion of a lower surface thereof; and a printed circuit board having first and second electrode pads so that the first and second external electrodes are mounted thereon, wherein the first and second electrode pads are disposed in positions diagonally opposed to each other, based on the ceramic body.

Mounting circuit board of multilayer ceramic capacitor

A multilayer ceramic capacitor may include a ceramic body having a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The first and second external electrodes may include: first and second internal conductive layers; first and second insulating layers; and first and second external conductive layers.

Multilayer ceramic capacitor

An electronic chip component includes a ceramic body; external electrodes formed on end portions of the ceramic body; an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes a first electrode pad formed on a surface thereof and having the external electrodes disposed thereon, a second electrode pad formed on an opposing surface thereof, and a connection electrode pad connecting the first electrode pad to the second electrode pad and formed on a lateral surface between the surface and the opposing surface of the interposer, the first electrode pad is divided into first and second electrode patterns disposed at ends of the interposer based on a space formed therebetween, a non-electrode margin portion is formed between ends of the first electrode pad and ends of the interposer, and the connection electrode pad is formed on the lateral surface of the interposer.

Growing community of inventors

Suwon-Si, South Korea

Soon Ju Lee