Semes Co., Ltd.

Samsung Electronics Co., Ltd.

Soon Hyun Kim

Seung Dae Seok

Hang Lim Lee

Jong Jin Weon

Byung Geun Kim

Byoung Chan Lee

A heater assembly includes a housing having an accommodation space therein and having a cooling gas inlet communicating with the accommodation space, a heater coupled to the housing, and a porous block disposed in the accommodation space.

Heater assembly and bonding head including same

A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

Bonding head and die bonding apparatus having the same

Growing community of inventors

Cheonan-si, South Korea

Soon Hyun Kim