Samsung Electro-mechanics Co., Ltd.

Soon-Gyu Yim

Woon-Chun Kim

Young-Do Kweon

Jae-Kwang Lee

Sung Yi

Yul-Kyo Chung

Seog-Moon Choi

Jin-Gu Kim

Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.

Semiconductor package with a metal post and manufacturing method thereof

A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

Method of manufacturing a printed circuit board with an embedded electronic component

Semiconductor package with a metal post

Electronic component embedded printed circuit board and manufacturing method thereof

A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other side of the semiconductor chip.

Semiconductor chip package and printed circuit board

Growing community of inventors

Seongnam-si, South Korea

Soon-Gyu Yim