Texas Instruments Corporation

Advanced Systems Automation Limited

Emage Equipment Pte. Ltd.

Soon Chye Lian

Thiam Beng Lim

Soon Wei Wong

Tiang Siong Lian

Zhen Hua He

Trung Hieu Nguyen

Illumination systems and methods of designing and construction of the same are disclosed. The resulting illumination systems comprising both Front and Back light modules, provides selectable and programmable illumination according to the requirements of the invention for optimal performance of enhancing defects on a multidimensional object. The light guides are suitably aligned to the Backlight module and mechanically integrated with spring loaded mechanisms to enable them to move freely and subsequently re-postion them to a reference home position as determined at the time of setup of the illumination assembly. The Front light module is utilised to highlight surface defects and mechanically integrated to the illumination system. The illumination modules, may include multiple discrete light emitting components of different spatial intensity distribution and color spectrum mounted in specific layout such that the application oriented combined illuminating effect is created.

Adaptive lighting system and method for inspection of complex objects

A BGA mould assembly which can facilitate high degree of control over the clamping force on BGA substrates of varying thickness. An Independent drive is provided for each of the dual in-line cavity bars which clamp the BGA substrates. The drive mechanism is a wedge press which includes a servo motor, and a linear-conversion mechanism coupled to the servo motor to convert the rotation motion of the motor to a linear movement. An input wedge is coupled to the linear-conversion mechanism such that the input wedge moves correspondingly with the linear movement of the linear conversion mechanism. An output wedge is coupled to the cavity bar and positioned such that a horizontal movement by the input wedge causes the output wedge to move downwards. A roller cage is provided at the top and bottom of the input wedge to reduce friction.

BGA mould assembly for encapsulating BGA substrates of varying thickness

The degree of wire sweep and wire clearance over the buss bars in the 16 Mega Bit LOC package is found to be dependent on the angle of the bond wires. A positive wire angle range of 5 to 15 degrees is recommended for minimum wire sweep and maximum wire clearance over the buss bars. This is so because they offer the least resistance to the flow of the mold compound during transfer molding. A staggered gating system ensures that the wire angles in all cavities are positive with respect to the gate. This invention is also applicable to conventional packages.

Bond wire configuration and injection mold for minimum wire sweep in

Growing community of inventors

Singapore, Singapore

Soon Chye Lian