Semes Co., Ltd.

Soon Cheon Cho

Jong Won Park

Yoon Seok Choi

Hyun Joong Kim

Sang Jeong Lee

Bongkyu Shin

Hyun Woo Jo

A plasma processing apparatus is provided. The plasma processing apparatus includes a chamber having a processing space defined therein in which plasma is generated; and a plasma generation unit configured to excite gas in the processing space into a plasma state, wherein the plasma generation unit includes: a first power supply to supply power for generation of the plasma; a coil connected to the first power supply; a first shunt capacitor disposed between and connected to a first node of the coil and a ground; and a second shunt capacitor disposed between and connected to a second node other than the first node of the coil and the ground.

Plasma processing apparatus and plasma processing method using the same

Disclosed are a coating apparatus and a coating method. The coating apparatus includes a chamber, a support located in an interior space of the chamber and configured to support a substrate which is to be coated, an ejection nozzle configured to eject a coating material toward the support, and an electric field forming unit configured to form an electric field in a movement path of the coating material to provide kinetic energy for the coating material.

Coating apparatus and coating method

Growing community of inventors

Gyeonggi-do, South Korea

Soon Cheon Cho