Az Electronic Materials (Luxembourg) S.a.r.l.

Merck Patent Gmbh

SookMee Lai

Weihong Liu

Chunwei Chen

Medhat A Toukhy

PingHung Lu

Aritaka Hishida

Yoshiharu Sakurai

Ping-Hung Lu

Stephen Meyer

SangChul Kim

The present application for patent relates to a light-sensitive positive working photosensitive composition especially useful for imaging thick films using a composition which gives very good film uniformity and promotes a good process latitude against feature pattern collapse in patterns created upon imaging and developing of these films.

Positive working photosensitive material

The invention relates to a novel positive working photosensitive composition having: at least one photoacid generator; at least one novolak polymer; at least one polymer, having a polymer backbone, said polymer comprising a structure of the following formula: wherein R-Rare, independently, &#x2014;H or &#x2014;CH, A is a linear or branched C-Calkylene group, B is a C-Calkyl or alicyclic group, D is a linking group that may be a chemical bond, a carboxylate group, wherein the carbonyl carbon is bonded to the polymer backbone, or a &#x2014;COOCH&#x2014; group, wherein the carbonyl carbon is bonded to the polymer backbone, Ar is a substituted or unsubstituted aromatic group or heteroaromatic group, E is a linear or branched C-Calkylene group, G is an acid cleavable group. The invention further relates to a process for using the novel composition for forming an image.

Positive photosensitive material

Disclosed are compositions for negative-working thick film photophotoresists based on acrylic co-polymers. Also included are methods of using the compositions.

Negative-working thick film photoresist

Disclosed herein is a photosensitive composition comprising a heterocyclic thiol compound or tautomeric form thereof and its method of use on a substrate, which may include a chalcophile substrate.

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Kakegawa, Japan

SookMee Lai