Infineon Technologies Ag

Sook Woon Chan

Chau Fatt Chiang

Swee Kah Lee

Kok Yau Chua

Mei Chin Ng

Joachim Mahler

Chee Yang Ng

Soon Lock Goh

Beng Keh See

Guan Choon Matthew Nelson Tee

Matthias Steiert

Stefan Martens

Muhammad Muhammat Sanusi

Hock Heng Chong

Pei Luan Pok

Fong Mei Lum

Chee Hong Fang

Yean Seng Ng

Choon Huey Wang

Khar Foong Chung

Hock Siang Chua

Muhammat Sanusi Muhammad

Kian Hong Yeo

A method for fabricating a semiconductor device with a heterogeneous solder joint includes: providing a semiconductor die; providing a coupled element; and soldering the semiconductor die to the coupled element with a first solder joint. The first solder joint includes: a solder material including a first metal composition; and a coating including a second metal composition, different from the first metal composition, the coating at least partially covering the solder material. The second metal composition has a greater stiffness and/or a higher melting point than the first metal composition.

Semiconductor device with a heterogeneous solder joint and method for fabricating the same

An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.

Over-under sensor packaging with sensor spaced apart from control chip

A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.

Manufacturing a package using plateable encapsulant

A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.

Semiconductor package and method for fabricating a semiconductor package

A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.

Semiconductor package with plateable encapsulant and a method for manufacturing the same

A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically conductive leads, a ridge formed around a perimeter of the first opening, and an electrically insulating molding compound. The electrically insulating molding compound includes an interior cavity being defined by a planar base surface and outer sidewalls, a second opening formed in the base surface, and an interior sidewall within the interior cavity. The molding compound is formed around the lead-frame with the first die paddle in the interior cavity. The first and second openings are aligned with one another so as to form a port that provides access to the interior cavity. The ridge and the interior sidewall form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.

Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device

Growing community of inventors

Melaka, Malaysia

Sook Woon Chan