Lg Innotek Co., Ltd.

Sook Hyun Kim

Yong Sang Cho

Jong Bae Shin

Boone Won

Sang Gon Kim

Jong Min Lee

Myoung Lae Roh

Chae Hoon Kim

Jun Taek Lee

Hyung Eui Lee

Yong Joo Lee

A heat conversion device according to an embodiment of the present invention comprises: a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs which are electrically connected and arranged in an array; an insulating part disposed on one surface of the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a heat sink disposed on the insulating part; a fan disposed spaced a predetermined distance from the heat sink; and a plurality of fastening members having moduli of elasticity of 1*10kgf/cmto 30*10kgf/cmand fixing the heat sink and the fan. Each one of the fastening members comprises: a shaft part; a first fixed part which is disposed at one end of the shaft part and fixed to the heat sink; a second fixed part which protrudes from an outer circumferential surface of the shaft part and is fixed to the fan; and a separating part which protrudes from the outer circumferential surface of the shaft part and is disposed between the heat sink and the fan to separate the heat sink and the fan, wherein the width of the second fixed part increases toward the first fixed part, and the shaft part, the first fixed part, the second fixed part, and the separating part are integrally formed.

Heat conversion device

The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Thermoelectric module, and heat conversion apparatus comprising the same

Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Thermoelectric material and thermoelectric element including the same

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Seoul, South Korea

Sook Hyun Kim