Samsung Electronics Co., Ltd.

Soojeoung Park

Bona Baek

Yongho Kim

Heeseok Lee

Hyuekjae Lee

Su-Min Park

Seungduk Baek

Jongkook Kim

Minki Kim

Hei Seung Kim

Yoonha Jung

Hohyeuk Im

Byoungwook Jang

A semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode that penetrates through the first semiconductor layer, a first bonding pad connected to the first through-electrode, and a first insulating bonding layer, and a second semiconductor chip on the first semiconductor chip and including a second semiconductor layer, a second bonding pad bonded to the first bonding pad, and a second insulating bonding layer bonded to the first insulating bonding layer, wherein the first insulating bonding layer includes a first insulating material, the second insulating bonding layer includes a first insulating layer that forms a bonding interface with the first insulating bonding layer and a second insulating layer on the first insulating layer, the first insulating layer includes a second insulating material, different from the first insulating material, and the second insulating layer includes a third insulating material, different from the second insulating material.

Semiconductor package with bonding interface

A semiconductor package includes a redistribution layer and a semiconductor chip provided on the redistribution layer having a first surface and a second surface opposite to the first surface. The semiconductor chip includes a first chip pad and a second chip pad which are exposed at the first surface. The semiconductor package further includes a capacitor chip disposed between the first surface and the redistribution layer and including a capacitor chip pad connected to the first chip pad, an insulating layer covering the first surface and the capacitor chip, and a conductive post being in contact with the second chip pad and penetrating the insulating layer so as to be connected to the redistribution layer. The conductive post may be spaced apart from the capacitor chip.

Semiconductor package

A semiconductor device includes a semiconductor chip, pads provided on the semiconductor chip, and insulating patterns provided on the semiconductor chip. The insulating patterns having openings exposing the pads, and conductive patterns are provided in the openings and coupled to the pads. When viewed in a plan view, two opposite ends of the pads are spaced apart from the conductive patterns and two opposite ends of the conductive patterns are spaced apart from the pads. Additionally, when viewed in a plan view, the conductive patterns include a first conductive pattern whose length is parallel to a first direction and a second conductive pattern whose length is parallel to a second direction. The first and second directions are oblique to each other.

Semiconductor device

Provided are a semiconductor package and a method of fabricating the same. The package substrate includes a hole, which may be used to form a mold layer without any void. The mold layer may be partially removed to expose a lower conductive pattern. Accordingly, it is possible to improve routability of solder balls.

Semiconductor package and method of fabricating the same

A semiconductor package comprises a lower package comprising a lower substrate, a lower semiconductor chip on the lower substrate, a lower graphene layer on the lower semiconductor chip, and a lower molding layer between the lower substrate and the lower graphene layer. An upper package is on the lower substrate, the upper package spaced apart from the lower package, the upper package comprising an upper substrate, an upper semiconductor chip, and an upper molding layer. Lower conductive bumps are positioned between the lower substrate and the upper substrate, the lower bumps comprising a ground bump and a signal transmitting bump.

Semiconductor packages including graphene layers

A semiconductor package includes a substrate, a ground circuit supported by the substrate, at least one semiconductor chip disposed on the substrate and a carbon-containing heat-dissipating part disposed on the substrate and electrically connected to the ground circuit. The heat-dissipating part may include carbon fibers and/or carbon cloth.

Growing community of inventors

Hwaseong-si, South Korea

Soojeoung Park