Samsung Electro-mechanics Co., Ltd.

Soo Young Ji

Seung Hwan Kim

Suk Jin Ham

Tae Ho Kim

Jung Hyun Lee

Jeong Suong Yang

Jung Eun Noh

Do Young Kim

Nam Soon Moon

Dae Chul Choi

Hwan Soo Yoo

An all solid state battery includes: a battery body including an electrode assembly having first and second surfaces in a first direction, third and fourth surfaces in a second direction, and fifth and sixth surfaces in a third direction, and including a solid electrolyte layer and a cathode and an anode; a first connection portion; and a second connection portion disposed on the electrode assembly. The first connection portion includes a first current collecting electrode and a first protection portion, the second connection portion includes a second current collecting electrode and a second protection portion, and the first current collecting electrode is drawn out to one surface of the first connection portion in the third direction and the second current collecting electrode is drawn out to one surface of the second connection portion in the third direction.

All solid state battery and method of manufacturing the same

An electronic component includes: a body having electrical insulating properties; an external electrode disposed on an external surface of the body; and a reinforcing layer disposed on a surface of the body and including a metal oxide layer and a graphene oxide layer.

Electronic component and system-in-package

Disclosed herein are an anisotropic conductive film and a method for manufacturing the same. The anisotropic conductive film according to the present invention includes: an insulating resin; and a plurality of conductive graphenes dispersed into the insulating resin.

Anisotropic conductive film and method for manufacturing the same

Disclosed herein are a molding composition for a semiconductor package including a liquid crystal thermosetting polymer resin and graphene oxide to thereby effectively decrease coefficient of thermal expansion (CTE) and warpage and maximize an effect of thermal conductivity, and a semiconductor package using the same.

Molding composition for semiconductor package and semiconductor package using the same

The present invention relates to an insulating composition for a substrate including a soluble liquid crystal thermosetting oligomer, a metal alkoxide, a graphene oxide, and a short fiber, and an insulating material and a substrate using the same. The insulating composition in accordance with the present invention can effectively reduce the coefficient of thermal expansion by the addition of the metal alkoxide and the graphene oxide. Therefore, it is possible to provide a substrate material with greatly increased strength and rigidity by the addition of the short fiber as well as to manufacture a substrate with improved thermal stability by using the insulating composition in accordance with the present invention as an insulating material of the substrate to minimize dimensional deformation due to heat.

Insulating composition for substrate, and prepreg and substrate using the same

Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same. The insulating layer composition according to the present invention can effectively lower a coefficient of thermal expansion thereof, and thus, a dimensional change due to heat can be minimized when the insulating layer composition is used as an insulation material of the substrate, resulting in a substrate having improved thermal stability.

Growing community of inventors

Suwon-si, South Korea

Soo Young Ji