Koh Young Technology Inc.

Kyungpook National University Industry-Academic Cooperation Foundation

S-Printing Solution Co., Ltd.

Hp Printing Korea Co., Ltd.

Soo-Young Cho

Se-Young Kim

Bong-Ha Hwang

Neville Stanley Brody

Min-young Kim

Hee-Tae Kim

Nu-Ri Choi

Seok-Young Kang

Hee-Wook You

Pyung-Hwa Lee

Eun-kyung Yun

Jue-Hyun Jung

Ju-Hyun Jung

Sang-Joon Lee

To inspect a board, first, a measurement area is set on the board and a reference data of the measurement area is obtained. Then, a measurement data of the measurement area is obtained per colors, and a lighting condition is set using the reference data of the measurement area and the measurement data obtained per colors. Next, a feature object in the measurement area is set, and a distortion quantity between the reference data and the measurement data is obtained by comparing the reference data corresponding to the feature object and the measurement data corresponding to the feature object obtained under the lighting condition. Then, an inspection area is set by compensating the distortion quantity. Therefore, it is possible to compensate the distortion and set precisely the inspection area.

Inspection method

A method of inspecting a substrate is disclosed. The method is performed by a substrate-inspecting apparatus having at least one projecting module projecting a patterned light onto a substrate fixed on a stage and an inspecting module with a camera capturing an image, and inspecting a plurality of inspection regions of the substrate step by step. The method comprises, setting an inspection order of the inspecting regions according to a lengthwise direction of the substrate, estimating height displacement of a target inspection region by using a tendency information regarding at least one previous inspection region that is already inspected, adjusting height of the inspecting module by using the estimated height displacement of the target inspection region, and inspecting the target inspection region by using the inspecting module of which height is adjusted. Therefore, inspection time is reduced.

Method of inspecting a substrate

Transfer film

In order to inspect a board, a measurement area is set on a board, and reference data and measurement data of the measurement area are acquired. Then, a conversion condition is established for the measurement area, and a conversion relation is acquired according to a distortion degree between reference data and measurement data. Thereafter, validity of the conversion relation is verified by using at least one of verifying that a comparison feature object satisfies the conversion relation, verifying that a verification feature object selected from feature objects satisfies the conversion relation and verifying that a pad formed on the board satisfies the conversion relation. Then, the conversion condition is confirmed, and an inspection area for inspecting a measurement target is set according to the confirmed conversion condition. Thus, an inspection area may be correctly set so that distortion is compensated for.

Growing community of inventors

Seoul, South Korea

Soo-Young Cho