Samsung Electro-Mechanics Co., Ltd.

Soo Yeol Kim

Se Woong Paeng

Jong Seok Bae

A coil component includes a body, a support substrate, a coil portion on one surface of the support substrate, and first and second external electrodes disposed on the body and connected to the coil portion. 100 μm≤0.5*b*tan θ, where, on a cross-section perpendicular to the one surface of the support substrate, P1 is a point among points at which an outline of one coil turn and the support substrate intersect, P2 is a point among points at which an outline of an adjacent coil turn and the support substrate intersect, P3 is a point among points of the one coil turn having a maximum line width, 'a' is a length of a first virtual segment connecting P1 to P3, ‘b’ is a length of a second virtual segment connecting P1 to P2, and θ is an angle defined by the first and second virtual segments.

Coil component

An inductor includes a body in which is disposed a coil connecting a plurality of coil patterns by a via. The via includes a first conductive layer and a second conductive layer disposed on the first conductive layer, and the via has an upper portion having a transverse cross-sectional area that is greater than a transverse cross-sectional area of a lower portion thereof. An interlayer contact area of coils may be increased, thereby improving electrical characteristics and connection reliability.

Inductor and method of manufacturing the same

An inductor includes a body in which is disposed a coil formed as a plurality of coil patterns connected by one or more via(s). Each via includes a first conductive layer and a second conductive layer formed on the first conductive layer, and a distance between portions of coil patterns connected by the via in the body is greater than a distance between other portions of the coil patterns in the body. Methods of forming inductors having vias including first and second conductive layers are also provided.

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Suwon-si, South Korea

Soo Yeol Kim