K. C. Tech Co., Ltd.

Soo Wan Choi

Kwang Soo Park

Jung Yoon Kim

Nak Hyun Choi

Jun Ha Hwang

Hae Won Yang

Gi Joo Shin

The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present disclosure comprises: a nonionic polymer having at least one amide bond; a selectivity control agent; and abrasive particles.

Polishing slurry composition

The present disclosure relates to a polishing slurry composition and a method of producing the same. The polishing slurry composition according to one embodiment of the present disclosure includes: abrasive particles dispersed so as to have positively-charged particle surfaces; a first dispersant including a nonionic linear polymer; and a second dispersant including an anionic coiling polymer, wherein the polishing slurry composition satisfies the following Expressions 1 and 2: [Expression 1] 4≤log(milling energy)<5; and [Expression 2] 20%≤Primary particle size reduction rate (%)<35%.

Polishing slurry composition and method for producing same

A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.

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Seoul, South Korea

Soo Wan Choi