Other

Ehwa Diamond Ind. Co., Ltd.

Soo Kwang Kim

So Young Yoon

Jong Ho Kim

Chang Hyun Lee

A diamond blade having rim type cutting tip for use in apparatus such as cutting saw machine having a structure which rim type cutting tip is able to produce cutting chips with relative large size during cutting operation so that those chips are easily discharged outside with reducing the friction with cutting tip of blade, thereby to increase cutting ability and to prevent the chips dispersing in the air and giving rise to the bad effects to user's health and the contamination of environment. The diamond blade according to the present invention comprises a wheel body connected with a shaft of electric motor, and rim type cutting tip for cutting or grinding crushable materials disposed on the circumference of the wheel body and composed of at least two diamond layers longitudinally disposed parallel with the rotation direction of the blade in which diamond particles are included, and non-diamond portion disposed between the diamond layers in which diamond particles are not included.

Diamond blade having rim type cutting tip for use in grinding or cutting apparatus

A diamond tool having segment type cutting tip for cutting, grinding or drilling workpieces. The diamond tool comprising a plurality of segment type cutting tips circumferentially fixed on the wheel of the diamond tool, each of which has at least two diamond layers longitudinally disposed parallel with the rotation direction of the diamond tool, and capable of effectively cutting, grinding or drilling workpieces as forming at least two microscopic linear cutting groves in the workpieces when cutting operation.

Diamond blade having segment type cutting tip for use in cutting, grinding or drilling apparatus

A segment type diamond tool, used for cutting or drilling brittle substances, such as stones, bricks, concrete structures, or asphalt structures, is disclosed. In the diamond tool, the segments are each set with diamonds in a single-layered structure or a multi-layered structure, and are alternately or intermittently arranged on a steel core, different from conventional diamond tools having segments randomly set with diamonds. Such a diamond arrangement of this invention allows the diamonds to more effectively perform their cutting action, and so the diamond tool has an increased cutting rate, in addition to reducing the amount of fine debris generated during a cutting or drilling process to ill-affect worker's health or cause environmental pollution. In the segments each set with diamonds in the single-layered or multi-layered structure, the diamond arrangement is designed such that the diamonds of each trailing segment form grooves on the surface of a brittle substance along the lands between grooves previously formed on the surface of the brittle substance by the diamonds of a leading segment.

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Irvine, CA, United States of America

Soo Kwang Kim