Stats Chippac Pte. Ltd.

Amkor Technology, Inc.

Proteometech Inc.

Soo Jung Park

Hun Teak Lee

Tae Keun Lee

HeeJo Chi

HanGil Shin

Young Suk Chung

Bum Joon Kim

Junwoo Myung

Kook Jin Lim

Kyung Hwa Yoo

Jin Ik Lim

Provided is a composition for detecting a protein, containing a tyrosine oxide-coupled biomaterial. Various diseases may be easily and rapidly diagnosed by easily detecting the composition containing a tyrosine oxide-coupled biomaterial according to the present invention, by identifying a color of the protein bound with a tyrosine oxide-coupled biomaterial prepared by binding tyrosine oxide, which is a natural pigment present in a living body, with the biomaterial. Accordingly, the composition of the present invention may be used to easily and rapidly diagnose various diseases in real time in an operating room, and may usefully replace conventional histological analysis without a secondary antibody reaction and a final operation of color expression.

Composition for detecting proteins containing tyrosine oxide-coupled biomaterial

A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.

Stackable integrated circuit package system

A method of manufacture of an integrated circuit packaging system includes: forming a first terminal; connecting an integrated circuit to the first terminal; forming a second terminal connected over the first terminal and the integrated circuit by a vertical conductive post integral with the first terminal or the second terminal; and encapsulating the integrated circuit and the vertical conductive post leaving portions of the first terminal and the second terminal exposed.

Integrated circuit packaging system with dual side connection and method of manufacture thereof

A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the substrate, the heat spreader extending over the first integrated circuit and between the opposite sides of the first integrated circuit.

Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof

An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.

Integrated circuit package system employing thin profile techniques

A clamp and heat block assembly for wire bonding a semiconductor package assembly. The package assembly has a semiconductor chip having a plurality of bond pads on an upper surface the chip, a chip paddle secured to a bottom surface of the chip by an adhesive, a plurality of tie bars being connected to corners of the chip paddle and externally extending from the chip paddle, a plurality of leads radially formed at regular intervals along and spaced apart from the chip paddle and extending towards the chip paddle. The package assembly further includes a plurality of conductive wires electrically connected to the leads and the chip. The heat block assembly includes a heat block, a guide block, and a clamp. The guide block has a raised portion for receiving the heat block, which has a groove mating with the raised portion of the guide block. The guide block and heat block are secured to the package assembly by the clamp, which engages the package assembly on an upper surface of the leads. The clamp has a notch adapted to identify a first lead of the package assembly.

Growing community of inventors

Icheon-si, South Korea

Soo Jung Park