Samsung Electronics Co., Ltd.

Soo-Jin Paek

Ki-sung Kim

Woo-seop Kim

Jae-Wook Lee

Ho-keun Cho

A semiconductor package having a structure in which heat produced in the interior of the package is effectively spread to the outside of the package is provided. The semiconductor package includes one or more semiconductor chips, one or more substrates (PCBs) having the semiconductor chips respectively attached thereto, a plurality of conductive balls such as a plurality of solder balls to provide voltages and signals to the one or more semiconductor chips, and a heat sink positioned to spread heat produced in the interior of the package to the outside and directly connected to at least one of the plurality of solder balls.

Semiconductor package having improved heat spreading performance

In phase locked loop, a phase detector detects a phase difference between a first clock signal and a second clock signal and output a first output signal based on the detected difference. A charge pump generates a control voltage in response to the first output signal from the phase detector. A voltage-controlled oscillator generates the second clock signal. A controller controls the control voltage such that the phase difference between the first clock signal and the second clock signal is increased in response to a burn-in test mode signal.

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Gyeonggi-do, South Korea

Soo-Jin Paek