Samsung Electro-mechanics Co., Ltd.

Soo Hyun Lyoo

Yong Seok Choi

Beom Joon Cho

Yul Kyo Chung

Jong Myeon Lee

Ho Sung Choo

Eun Tae Park

Myung Whun Chang

Se Woong Paeng

Jin Seok Moon

Seung Hyun Sohn

Tae Hoon Kim

Ki Pyo Hong

Jung Min Kim

Sang Jun Lee

Jeong Gu Yeo

Ji Hyung Jung

Ji Man Ryu

Seung Gyo Jeong

Jong Seok Bae

Do Young Jung

Min Ji Ko

An inductor includes a body including a coil, the coil including a plurality of coil patterns connected by a via, is disposed, wherein the via includes a first conductive layer and a second conductive layer, formed on the first conductive layer, and the second conductive layer includes a conductive powder and an organic material.

Inductor and manufacturing method of the same

An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.

Inductor

There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered.

Ceramic laminate and method of manufacturing ceramic sintered body

Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBiO-bBO-cSiO-dBaO-eTiO, where a+b+c+d+e=100, and a, b, c, d, and e are 40&#x2266;a&#x2266;89, 10&#x2266;b&#x2266;50, 1&#x2266;c&#x2266;20, 0&#x2266;d&#x2266;10, and 0&#x2266;e&#x2266;10, respectively.

Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same

There are provided a ceramic laminate and a method of manufacturing a ceramic sintered body. A ceramic laminate according to an aspect of the invention may include: at least one ceramic sheet having first ceramic particles and glass particles; and at least one constraining sheet having second ceramic particles and alternating with the ceramic sheet while the constraining sheet and the ceramic sheet are in contact with each other, wherein the glass particles and the first ceramic particles each have a larger particle size than the second ceramic particles, and the first ceramic particles have a particle size of 1 &#x3bc;m or more, the glass particles have a particle size within the range of 1 &#x3bc;m to 10 &#x3bc;m, and the second ceramic particles have a particle size of 1 &#x3bc;m or less. An aspect of the present invention provides a ceramic laminate having constraining layers that can evenly exert a constraining force onto a ceramic laminate during sintering.

Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiOof about 80 wt % or more, and an accessory component, CuBiOand ZnO&#x2014;BO&#x2014;SiO-based glass of about 20 wt % or less.

Dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same

Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and

Thin film capacitor-embedded printed circuit board and method of manufacturing the same

Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of fired ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.

Method of manufacturing multilayer ceramic substrate

Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

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Yongin, South Korea

Soo Hyun Lyoo