Samsung Electronics Co., Ltd.

Korea Advanced Institute of Science and Technology

Soo Hwan Lee

Hee Seok Park

Moo Youn Park

Hee Dong Kim

Chang Yong Shin

Tae Soo Kwon

Won Jong Noh

Yung Yi

Jong Sup Song

Ji Hoon Yun

Mi Jeong Yun

Saesil Kim

Provided is a semiconductor chip mounting tape. The semiconductor chip mounting tape comprises a tape base film including first and second surfaces opposite to each other; and an adhesive film including a third surface facing the first surface of the tape base film, and a fourth surface opposite to the third surface, wherein the adhesive film includes a plurality of voids therein, and the fourth surface of the adhesive film may be adhered to a semiconductor chip.

Semiconductor chip mounting tape and method of manufacturing semiconductor package using the tape

A semiconductor package includes a mounting substrate, a first semiconductor chip on the mounting substrate and electrically connected to the mounting substrate, a heat dissipation element on an upper surface of the first semiconductor chip, where the heat dissipation element comprises a sidewall comprising an inclined surface and an upper surface directly connected to the inclined surface, and a package molding portion on the mounting substrate and the inclined surface of the heat dissipation element. The package molding portion exposes at least a portion of the upper surface of the heat dissipation element, the upper surface of the heat dissipation element is parallel to the upper surface of the first semiconductor chip, and an angle formed by the upper surface of the heat dissipation element and the inclined surface of the heat dissipation element is an obtuse angle.

Semiconductor packages

An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising a convex curved surface. The optical device has an aspherical shape in a cross-section taken along a diagonal direction of the quadrangle and has a semicircular shape in a cross-section taken along a direction connecting a central portion of a first side of the quadrangle and a central portion of a second side opposite to the first side of the quadrangle. In a cross-sectional view of the optical device, the second surface is continuously varied between the semicircular shape of the cross-section and the aspherical shape of the cross-section.

Optical device and light emitting device package including the same

An LED assembly according to an embodiment of the present invention may improve dark regions generated between LED chips by employing a first reflective layer between the LED chips. By employing a transparent optical layer or an optical layer including a scattering particle between an LED chip and a phosphor layer, direct contact between the LED chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency. Further, by employing a second reflection layer on side surfaces of an to LED chip, an optical layer, and a phosphor layer, a relatively high contrast may be obtained. An LED assembly may enhance contrast through a reflective layer while increasing light extraction efficiency by including a scattering particle in a phosphor layer.

Light emitting device assembly and headlamp including the same

A data transmission system that determines data transmission power using a virtual cell is provided. A base station may receive transmission data from a plurality of cooperative base stations positioned around the base station, and model terminals receiving an interference signal from the base station and the plurality of cooperative base stations into a virtual cell. The base station may calculate the influence of the interference signal transmitted to the terminal, using the virtual cell, and determine a transmission power for a plurality of frequency bands based on the interference signal.

Data transmission system for determining data transmission power using a virtual cell

An LED assembly according to an embodiment of the present invention may improve dark regions generated between LED chips by employing a first reflective layer between the LED chips. By employing a transparent optical layer or an optical layer including a scattering particle between an LED chip and a phosphor layer, direct contact between the LED chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency. Further, by employing a second reflection layer on side surfaces of an LED chip, an optical layer, and a phosphor layer, a relatively high contrast may be obtained. An LED assembly may enhance contrast through a reflective layer while increasing light extraction efficiency by including a scattering particle in a phosphor layer.

Provided is a data transmission system that may determine a multiple input multiple output dynamic spectrum management (MIMO-DSM) operation mode of a base station based on information associated with a data transmission route and a computational capability of each base station. A terminal may generate feedback information based on a cooperation level between base stations and may transmit the generated feedback information to a serving base station. The serving base station may select terminals that may receive data from among a plurality of terminals through a MIMO-DSM algorithm and a user scheduling based on the feedback information.

Growing community of inventors

Daejeon, South Korea

Soo Hwan Lee