Samsung Electronics Co., Ltd.

Soo Ho Noh

Se Young Jang

Jae Ho Chung

Jin Seok Park

Jin Seok Yoon Park

An example electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.

Electronic device including cooling structure

An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.

Growing community of inventors

Suwon-si, South Korea

Soo Ho Noh