Arm Limited

Sony

Andy Wangkun Chen

Yew Keong Chong

Sriram Thyagarajan

Ayush Kulshrestha

Ettore Amirante

Rajiv Kumar Sisodia

Various implementations described herein are related to a device having logic that operates in multiple voltage domains. The device may include a backside power network with rows of segmented supply rails coupled to the logic. The rows of segmented supply rails may include alternating rail breaks that define an interchanging directional supply of power to the logic in the multiple voltage domains.

Backside power supply techniques

Various implementations described herein are directed to a method for identifying pre-routed metal lines in a higher layer of a multi-layered structure. The method may recognize gaps in the pre-routed metal lines of the higher layer, and also, the method may automatically fill the gaps with conductive stubs to modify the pre-routed metal lines in the higher layer as a continuous metal line with an extended length.

Metal routing techniques

Various implementations described herein are related to various devices having a frontside power network with frontside supply rails and a backside power network with backside supply rails. The device may include intermixing architecture with transition vias that couple the frontside power network to the backside power network. The intermixing architecture may transition the frontside supply rails of the frontside power network to the backside supply rails of the backside power network.

Frontside-to-backside intermixing architecture for coupling a frontside network to a backside network

Various implementations described herein refer to a device having logic circuitry with transistors and gate lines. The device may include a backside power network having buried supply rails with at least one buried supply rail having a continuity break. The transistors may be arranged in a cell architecture having an N-well break with the gate lines passing through the N-well break and the continuity break.

Cell architecture

Various implementations described herein refer to a device having backside power rails including first backside power rails that supply a core voltage to memory logic and second backside power rails that supply a periphery voltage to control logic. In some implementations, at least one first backside power rail may have a rail break that interrupts continuity so as to allow at least one second backside power rail to supply the periphery voltage to the control logic.

Backside power rail architecture

Various implementations described herein are related to a device having memory circuitry with a bitcell array. The device may include a frontside power network that is coupled to the bitcell array, and the device may include a backside power network that provides power to the bitcell array. The device may include transition vias that couple the backside power network to the frontside power network, and the backside power network may provide power to the bitcell array by way of the transition vias being coupled to the frontside power network.

Buried power rail structure for providing multi-domain power supply for memory device

Various implementations described herein are related to a device with a backside power network. The backside power network may have a buried power rail that is coupled to ground. The device may have a read-only memory (ROM) cell that is coupled between at least one bitline and the buried power rail, and the ROM cell may be coupled to ground by way of the buried power rail.

Bitcell architecture with buried ground rail

Various implementations described herein are related to a device having wordline drivers coupled to a core array. The device may have backside power network with buried power rails. The device may have header logic coupled to power supply connections of the wordline drivers by way of the buried power rails, and the header logic may be used to power-gate the wordline drivers.

Power-gating techniques with buried metal

Various implementations described herein are directed to a device having memory with a first array and a second array. The device may have power rails formed in frontside metal layers that supply core voltage to the memory. The power rails may include a first path routed through a first frontside metal layer to the first array of the memory, and the power rails may include a second path routed through the first frontside metal layer and a second frontside metal layer to the second array of the memory.

Techniques for powering memory

Various implementations described herein are related to a device with a frontside power network and a backside power network. The frontside power network may include frontside supply rails coupled to logic circuitry, and also, the backside power network may include buried supply rails. Also, at least one buried supply rail of the buried supply rails may be used as a backside signal path for providing at least one critical signal net to the logic circuitry.

Growing community of inventors

Noida, India

Sony