Robert Boschgmbh

Sonja Knies

Ulrike Scholz

Ando Feyh

Ricardo Ehrenpfordt

Christina Leinenbach

Andre Gerlach

Mathias Bruendel

Heribert Weber

Joerg Muchow

Frieder Haag

Axel Franke

Thorsten Pannek

Thomas Buck

Tjalf Pirk

Gustav Klett

Arnim Hoechst

Achim Trautmann

Maik Wiemer

Juergen Butz

Radoslav Rusanov

Rainer Holz

Joerg Froemel

Philipp Scheiner

Benno Roesener

Knut Gottfried

A component for establishing electrical contact between at least one functional element and a textile or the like. The component includes a main body, which accommodates at least one electrical component and/or one functional element, and includes connection elements for establishing electrical contact with electrically conductive regions of the textile or the like.

Component for establishing electrical contact between at least one functional element and a textile or the like and assembly comprising a component

A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate, at least one circuit chip mounted on the substrate, and an enveloping package in which the circuit chip is packaged. The functional apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement having a plurality of micromechanical loudspeakers, which is mounted on the enveloping package. A covering device is mounted above the micromechanical functional arrangement, particularly the loudspeaker arrangement, opposite the enveloping package. A method is implemented to manufacture the micromechanical functional apparatus.

Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture

A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate having a top and an underside and at least one circuit chip mounted on the underside in a first cavity. The apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement, having a plurality of micromechanical loudspeakers mounted on the top in a second cavity. A covering device is mounted above the micromechanical functional arrangement on the top. An appropriate method is implemented to manufacture the micromechanical functional apparatus.

A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.

Method for constructing an electrical circuit, and electrical circuit

A MEMS chip package includes a first chip, a second chip, a first coupling element, and a first redistribution layer. The first chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The second chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The first coupling element couples the first chip surface of the second chip to the first chip surface of the first chip, so that a first cavity is defined between the first chip and the second chip. The first redistribution layer is mounted on the second chip surface of the second chip and is configured to provide contact with a substrate.

MEMS chip package and method for manufacturing an MEMS chip package

A tire sensor module having a circuit carrier, on or in which at least one sensor element is attached for measuring a measured variable, an antenna for transmitting sensor signals to a receiving unit of the vehicle, and a housing, in whose housing inner chamber the circuit carrier is received, the antenna being provided in the housing material of the housing or on a housing side of the housing.

Tire sensor module and method for its manufacture

Growing community of inventors

Rutesheim, Germany

Sonja Knies