Heptagon Micro Optics Pte. Ltd.

Sonja Hanselmann

Hartmut Rudmann

Simon Gubser

Ji Wang

Jens Geiger

Stephan Heimgartner

Qichuan Yu

Xu Yi

Susanne Westenhöfer

Kam Wah Leong

John A Vidallon

Qi Chuan Yu

Thng Chong Kim

Christoph Friese

Kian Siang Ng

Guo Xiong Wu

Cris Calsena

This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

Optoelectronic modules including an image sensor having regions optically separated from one another

Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

Optical devices and methods of making same

Optical device

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Lachen, Switzerland

Sonja Hanselmann