Samsung Electronics Co., Ltd.

Samsung Electronics Ltd.

Songwon Hyun

Changho Noh

Insu Lee

Sangsoo Jee

Yoonseok Ko

In Gun Kim

Keechang Lee

Jonghoon Won

Kyeong Pang

Mooho Lee

Mijeong Kim

Hyejeong Lee

An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:E1-(M1)-(L1)-(M2)-L2-A1-L3-(M3)-(L4)-(M4)-E2  Formula 1E3-(A2)-(L5)-(M5)-L6-(M6)-L7-(M7)-(L8)-(A3)-E4  Formula 2 In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing epoxy compound

A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.E1-M1-L1-M2-L2-M3-L3-A-L3-M3-L2-M2-L1-M1-E2  Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same

An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:E1-(M1)-(L1)-(M2)-L2-A1-L3-(M3)-(L4)-(M4)-E2&#x2003;&#x2003;Formula 1E3-(A2)-(L5)-(M5)-L6-(M6)-L7-(M7)-(L8)-(A3)-E4&#x2003;&#x2003;Formula 2 In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

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Yongin-si, South Korea

Songwon Hyun