Medtronic, Inc.

Songhua Shi

Mark E Henschel

Andrew J Ries

Chunho Kim

Lea A Nygren

Scott B Sleeper

Mark S Ricotta

Yongqian Wang

Jemmy Sutanto

Rachel M Day

Darrin T Schauble

Lea Ann Nygren

Various embodiments of an electronics module and an implantable medical device that includes such module are disclosed. The module includes a feedthrough header assembly having a conductive header that includes a conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the header; and a feedthrough pin disposed within a via that extends through the header. The module further includes an electronic layer having a substrate and an electronic component disposed on or within the substrate. The electronic component is electrically connected to the contact of the conductive header such that the electronic component is electrically connected to the header. A major surface of the substrate of the electronic layer faces the conductive inner surface of the header without any intervening nonconductive layers disposed between the major surface of the substrate and the conductive inner surface of the header.

Feedthrough header assembly and device including same

Various embodiments of an electronic package and an implantable medical device that includes such package are disclosed. The electronic package includes a monolithic package substrate having a first major surface and a second major surface, an integrated circuit disposed in an active region of the package substrate, and a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate. The conductive via is separated from the active region by a portion of the inactive region of the substrate.

Electronic package and implantable medical device including same

In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature.

Medical devices

During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.

Systems for encapsulating a hybrid assembly of electronic components and associated methods

A medical device includes a printed circuit board, a connector mounted on the printed circuit board, and a polymeric body molded over the connector and the printed circuit board. The connector is configured to receive a medical lead and electrically and mechanically couple the lead to the printed circuit board. The connector comprises a housing and feedthrough assembly that includes a polymeric housing and a conductor. The housing defines a bore configured to receive the lead and defines a feedthrough opening through which the conductor extends. The housing and feedthrough assembly is sealed except for an aperture in communication with the bore. The connector further includes a contact disposed in the bore. The conductor electrically couples the contact with the printed circuit board. When a lead is properly received by the bore, the contact couples the lead to the printed circuit board via the conductor.

Growing community of inventors

Chandler, AZ, United States of America

Songhua Shi