Taiwan Semiconductor Manufacturing Comp. Ltd.

Songbor Lee

Ming-Da Cheng

Tzy-Kuang Lee

Ching-Hua Kuan

Jung-You Chen

Chia-Ming Huang

A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.

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Zhubei, Taiwan

Songbor Lee