Kyungdong One Corporation

Kyung Dong Mtec Co., Ltd.

Song Hee Yim

Bum Gyu Baek

Heung Rak Sohn

Jong Hyun Yoon

Jong Hyuk Yoon

Jae Pil Jung

Ashutosh Sharma

Jun Tae Kim

The present disclosure relates to a lead-free solder alloy composition in which a nanosized ceramic powder additive is added to a lead-free solder alloy of Sn—Cu—Bi, Sn—Ag—Bi or Sn—Ag—Cu—Bi, and a method for preparing the same.

Lead-free solder alloy composition suitable for use in high-temperature and vibration environments and preparation method thereof

This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.

Lead-free solder alloy composition and method for preparing lead-free solder alloy

Growing community of inventors

Pyeongtaek-si, South Korea

Song Hee Yim