Integrated Sensing Systems, Inc.

Sonbol Massoud-Ansari

Nader Najafi

Collin Anderson Rich

Catherine Hook Morgan

Yafan Zhang

Srinivas Tadigadapa

David Joseph Goetzinger

Matthew Z Straayer

A system for monitoring blood pressure and other physiologic parameters is provided. The system is designed such that it can be delivered to the patient with ease and minimal invasion. The system contains at least one self contained implantable sensing device consisting of a sensor, an electrical circuit for signal conditioning and magnetic telemetry, a biocompatible outer surface and seal, an anchoring method, and an external readout device. The implant is small in size so that it may be delivered to the desired location and implanted using a catheter, although direct surgical implantation is also possible. The circuit, sensor, and antenna for telemetry are packaged together and sealed hermetically to the biologic environment. The larger readout unit remains outside the body but proximal to the implant for minimizing communication distance.

Wireless device and system for monitoring physiologic parameters

An implantable system and method for deep brain stimulation (DBS) treatments. The implantable system is sufficiently small and self-contained to enable implantation of the entire system within the brain, or optionally within the brain and the surrounding tissue. The system comprises an implantable inductor on which a voltage is induced when subjected to an electromagnetic field, and an implantable device comprising a housing, stimulating elements at an exterior surface of the housing, and electronics within the housing and electrically connected to the implantable inductor. The electronics produces a brain-stimulating current from the voltage induced on the implantable inductor and then delivers the brain-stimulating current to the stimulating elements. Deep brain stimulation is performed by subjecting the inductor to an electromagnetic field to induce a voltage on the inductor that powers the electronics to produce and deliver the brain-stimulating current to the stimulating elements.

Miniature wireless system for deep brain stimulation

An anchor for an implantable sensing device, a sensor unit formed by the anchor and sensing device, and a surgical procedure for implanting the sensor unit for monitoring a physiological parameter within a cavity of a living body, such as an intracranial physiological property. The anchor includes a shank portion and a head portion. The shank portion defines a distal end of the anchor and has a bore defining an opening at the distal end. The head portion defines a proximal end of the anchor and has a larger cross-sectional dimension than the shank portion. The sensor unit comprises the anchor and the sensing device placed and secured within the bore of the anchor so that a sensing element of the sensing device is exposed for sensing the physiological parameter within the cavity.

Sensor unit and procedure for monitoring intracranial physiological properties

A system and surgical procedure for monitoring physiological parameters within an internal organ of a living body. The procedure entails making a first incision to expose the organ and a second incision through an external wall of the organ and into an internal cavity. A sensing unit is placed in the second incision such that a proximal end thereof remains outside the organ. The unit includes a sensing device having a sensing element for sensing the physiological parameter within the organ, and an anchor to which the sensing device is secured. The unit occludes the second incision and a distal end of the unit does not extend more than one centimeter into the cavity. The anchor is then secured to the wall of the organ, after which the first incision is closed and a readout device telemetrically communicates with the sensing device to obtain a reading of the physiological parameter.

Procedure and system for monitoring a physiological parameter within an internal organ of a living body

A system for non-invasively monitoring one or more physiological parameters such as pressure and/or pressure gradients in a cardiac conduit adapted for blood bypass flow. The system includes the conduit, at least one sensing device chronically located within the conduit, and a non-implantable readout device. The sensing device includes at least one inductor coil and at least one sensor for monitoring the one or more physiological parameters for diagnosis of the condition of the conduit after the conduit is implanted in a patient. The readout device includes at least one inductor coil allowing electromagnetic telecommunication and electromagnetic wireless powering of the sensing device through the inductor coil thereof.

System for monitoring conduit obstruction

The present invention relates to an implantable microfabricated sensor device and system for measuring a physiologic parameter of interest within a patient. The implantable device is micro electromechanical system (MEMS) device and includes a substrate having an integrated inductor and at least one sensor formed thereon. A plurality of conductive paths electrically connect the integrated inductor with the sensor. Cooperatively, the integrated inductor, sensor and conductive paths defining an LC tank resonator.

Wireless MEMS capacitive sensor for physiologic parameter measurement

Unwanted gasses created during bonding within micromachined vacuum cavities are reduced in a manner conducive to mass manufacturing. Two broad approaches may be applied separately or in combination according to the invention. One method is to deposit a barrier layer within the cavity (for example, on an exposed surface of the substrate). Such a layer not only provides a barrier against gases diffusing out of the substrate, but is also chosen so as to not outgas by itself. Another approach is to use a material which, instead of, or in addition to, acting as a barrier layer, acts as a getterer, such that it reacts with and traps unwanted gases. Incorporation of a getterer according to the invention can be as straightforward as depositing a thin metal layer on the substrate, which reacts to remove the impurities, or can be more elaborate through the use of a non-evaporable getter in a separate cavity in gaseous communication with the cavity. The invention is applicable to a wide range of micromachined devices and structures, including micromachined capacitive pressure sensors and other transducers, though the techniques are not limited to such applications. Anodic bonding is used in conjunction with a glass substrate, with the understanding that various types of substrates and bonding/attachment procedures may alternatively be used.

Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices

A method for packaging and protection of sensors, particularly so called microsensors is disclosed. A sensor unit (either a sensor chip or sensor package) is flip chip bonded to a substrate having a through hole, such that the sensing element is placed above the through hole. An underfill material is applied in such a way that due to capillary forces, the entire common area between the sensor and the substrate is completely filled, while the sensing element is not covered by the underfill material. This provides an effective way of sealing the sensing element from the side of the package containing the electronics. For a sensor chip that has been through a first level packaging process, the above mentioned method can still be used for bonding the sensor package to a substrate containing an access hole. For some applications one or multiple layers of protective coatings can be deposited on either one side or both sides of the sensor package for protection against the operating environment. For applications where the sensor is required to operate in a controlled pressure/controlled gas environment, a cavity can be created into the substrate, and the sensor chip can be flip chip bonded (and/or sealed) to the substrate in a controlled environment. An alternative method of packaging is disclosed where the sensor chip is fixed onto the substrate, and a cap is bonded to this substrate using dummy bumps for mechanical strength.

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El Dorado Hills, CA, United States of America

Sonbol Massoud-Ansari