Sv Probe Pte. Ltd.

Kulicke and Soffa Industries, Inc.

Cerprobe Corporation

Nidec Sv Probe Pte. Ltd.

Son N Dang

Gerald Back

Bahadir Tunaboylu

Rehan Kazmi

Reynaldo M Rincon

Habib Kilicaslan

H Dan Higgins

Lich Thanh Tran

Scott R Williams

Jeff Hicklin

John McCormick

Ivan Pipps

Gerry Back

Jordan L Wahl

A probe sanding fixture includes a base, a probe adapter including a probe guide defining one or more channels defined therein, and a sander tool including a sanding wheel and a gauge pin configured to process one or more probes positioned in the channels. The probe adapter is coupleable to the base such that the channels are extendable generally along a first axis. The sander tool is coupled to the base such that the sander tools is translatable along a second axis and rotatable about the first axis.

Methods and systems for processing one or more integrated circuit probes

In an embodiment, a modular space transformer for use in a probe card assembly includes a bottom plate, a guide plate, and a top plate. The guide plate is configured for mounting in a cut-out of the bottom plate. The guide plate has a first surface and a second surface and additionally has a first plurality of spaced electrical connections disposed in a plurality of apertures formed through the guide plate for providing electrical connections between a plurality of test probe contacts and a plurality of guide plate contacts. The top plate has a plurality of spaced electrical contacts disposed through the top plate with at least one of the plurality of guide plate contacts electrically connected to at least one of the plurality of spaced electrical contacts.

Modular space transformer for fine pitch vertical probing applications

A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.

Probe head structure for probe test cards

A dual tip test probe assembly for use in both cantilever and vertical probe applications includes first and second elongated test probes, each having a body portion and a tip portion with a tip configured to make contact with a device under test. An electrically-insulating material is disposed between but not in contact with the body portions of the first and second elongated test probes to electrically isolate the first and second elongated test probes. The first and second elongated test probes are held in alignment with respect to each other so that the tip of the first elongated test probe is adjacent to and not in contact with the tip of the second elongated test probe for making simultaneous contact with the device under test. The dual tip test probe assembly provides a low inductance and a small, stable footprint for testing small and/or non-flat test points.

Dual tip test probe assembly

A method and apparatus for a flattened probe element wire is provided. A probe element wire includes a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may includes a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.

Cantilever probe card

Methods are provided for shaping, maintaining the shape of, and cleaning a probe tip using a pad such as a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad may be formed from layers of adhesive material having abrasive particles in-between each layer. Using the pad, probe tips may be shaped as desired from an unfinished probe stock, substantially limiting the use of relatively expensive conventional machining operations. Further, the pad may also be used to maintain probe tips in a desired operating shape. Still further, the pad may be used to clean accumulated debris from the probe tip. Preferably, the maintenance and cleaning operations are performed on-line, with the probes operatively installed in connection with testing machinery.

Method of probe tip shaping and cleaning

A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.

Method and apparatus for probe tip cleaning and shaping pad

Probe testing of an integrated circuit so as to achieve low probe needle contact resistance without probe needles &ldquo;scrubbing&rdquo; against bonding pads is achieved at high test signal frequencies by a probe needle assembly ( ) including a plurality of probe needles ( ) each having a shank portion ( A), a curved flex portion ( B), and a contact tip ( C) on a free end of the flex portion, the shank portion ( A) being electrically coupled to an electrical test system. The shank portion ( A) of each probe needle is attached to a surface ( A) of an insulative layer ( ). The insulative layer is supported on a ground plane conductor . The flex portions ( B) of the probe needles ( ) extend beyond an edge of the insulative layer. A portion ( ) of the ground plane conductor ( ) extends beyond the insulator ( ) and is adjacent to all but an extending tip portion ( ) of the flex portion ( B) of each probe needle ( ). A thin insulator/guide layer ( B) is attached to the extending portion ( ) of the ground plane conductor ( ) and disposed between the extending portion and the flex portions ( B), the insulator/guide layer ( B) having a smooth, low friction surface to guide/stabilize the flex portions ( B) during flexing. The insulative layer ( ) and insulator/guide layer ( B) provide matched impedance between the shank and flex portions of the probe needles.

Growing community of inventors

Tempe, AZ, United States of America

Son N Dang