Intel Corporation

Somvir Singh Dahiya

Stephen H Gunther

Randy B Osborne

Chee Lim Nge

Chia-Hung Sophia Kuo

Julien Sebot

Zhongsheng Wang

Samantha Rao

Siang Yeong Tan

Joshua Een

Scot Kellar

A first circuit to receive from a sensor a thermal condition of a voltage regulator while circuitry comprising the voltage regulator is to regulate delivery of power to a power domain having first and second components. The circuitry is to control a first power consumption rate of the first component based on a first parameter and control a second power consumption rate of the second component based on a second parameter. The first circuit monitors the thermal condition and generates an evaluation result based on a test criterion. A second circuit receives from the first circuit a signal based on the evaluation result. Based on the signal, the second circuit is to signal the circuitry to change the first parameter. An amount of any change to the second parameter based on the evaluation result is different than an amount of change to the first parameter based on the evaluation result.

Thermally optimized power delivery

A thermal management scheme, for a multichip module, that is aware of various dies in a stack (horizontal and/or vertical) and heat generated from them, local hot spots in a victim die, and hot spots in aggressor die(s). Each victim die receives telemetry information from thermal sensors located in aggressor dies as well as local thermal sensors in the victim die. The telemetry information is used to enable a virtual sensing scheme where temperature for a target die (e.g., a victim die) and/or its intellectual property (IP) domain is estimated or calculated. The estimated or calculated temperature is then used for performance management of the victim and/or aggressor dies in the stack.

Thermal management in horizontally or vertically stacked dies

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Bengaluru, India

Somvir Singh Dahiya