Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Sok Gek Beh

Markus Heinrich Klein

Florian Schindler

Ian Stephen Millard

Mohd Fauzi Zainordin

Wing Yew Wong

Karsten Diekmann

Britta Göötz

Steven Rossbach

Kok Eng Ng

Boon Liang Yap

Mei See Boon

Hui Ying Pee

Shahrol Izzanni Abdul Manaf

Jun Jun Lim

Ahmad Thibraani Termizi

Khairul Mohd Arshad

Jason Rajakumaran Rajasegaran

Siew Lee Yeoh

Mardiana Binti Khalid

An optoelectronic component is disclosed. In an embodiment an optoelectronic component includes a housing body, an optical element and a rabbet comprising a shoulder and a cheek, wherein the rabbet is located on an upper side of the housing body, wherein the optical element is located in the rabbet such that a brim of the optical element rests on the shoulder of the rabbet, wherein the upper side of the housing body comprises a rectangular shape, and wherein the shoulder of the rabbet is located only at corners of the rabbet.

Optoelectronic component with a housing body and an optical element both including a reflector

A light-emitting component is provided which comprises a carrier, a reflective layer and a light source, wherein the light source is mechanically fixed on a mounting surface of the carrier. The carrier has an electrically isolating basic body comprising an edge region, said edge region bounding the mounting surface. The edge region comprises a recess, wherein the reflective layer covers a base surface of the recess. Moreover, the mounting surface is vertically elevated with respect to the base surface of the recess at least in places, such that the reflective layer is kept away from the mounting surface. Furthermore, a method for producing such a light-emitting component is provided.

Light-emitting component and method for producing a light-emitting component

A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.

Package for an electronic component, electronic component and electronic arrangement

A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions each having a maximum width, wherein the mounting area is arranged at the third portion, and the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extent of the first part such that the third portion faces the second part.

Leadframe and chip package comprising a leadframe

An optoelectronic device includes a carrier, a housing, and a radiation source that emits electromagnetic radiation arranged on the carrier, wherein the housing is fixed to the carrier by a glue layer, the glue layer is arranged between a first face of the housing and a second face of the carrier, the first face of the housing and the second face of the carrier are arranged at an inclination angle to each other, a distance between the first face and the second face increases from an outer rim in a direction to a middle area of the carrier, and a thickness of the glue layer increases at least partially from the outer rim in the direction to the middle area of the carrier.

Optoelectronic device

A light emitter with a radiation exit surface including a housing part with a receptacle, at least one organic optoelectronic device, arranged in the receptacle, and at least one cover part joined to the housing part, wherein the device is mounted between the cover part and the housing part.

Light-emitting means and use

A radiation emitting device includes a substrate and a layer sequence disposed on top of the substrate. The layer sequence includes a first electrode surface with a first contact for applying a voltage, at least one functional layer that emits radiation during operation, and a second electrode surface. In the layer sequence, a plurality of partial regions is present that is modified in such a way that the emission of radiation visible to an external observer therefrom is interrupted. The distribution density of these partial regions can vary depending on their distance from the contact.

Light emitting device with a layer sequence having electrode surfaces and partial regions

The invention relates to a radiation emitting device, with a substrate () and a layer sequence disposed on top of it. Said layer sequence comprises a first electrode surface () with a first contact () for applying a voltage, at least one functional layer (), which emits radiation during operation, and a second electrode surface (). In the layer sequence, a plurality of partial regions is present that is modified in such a way that the emission of radiation visible to an external observer therefrom is interrupted. The distribution density of these partial regions varies depending on their distance from the contact.

Growing community of inventors

Penang, Malaysia

Sok Gek Beh