Denso Corporation

Soji Masui

Yasuki Furutake

Takeshi Kazama

Daisuke Takama

Kazuma Yamaguchi

Sho Okuda

Yoichi Kajino

Hirokazu Saito

Takashi Aoki

Nobuhisa Shimizu

Ken Nishioka

Kensuke Chikata

Yoshihide Itou

Naoyuki Kurake

Kazuya Kushida

Shunsuke Ito

A printed circuit board capable of reducing or suppressing connection failure includes a base film made of insulating material, an electric conductor pattern formed on a front surface of the base film, and an insulating cover film covering the electric conductor pattern. The printed circuit board also includes a circuit portion with a circuit formed by the electric conductor pattern, and a pad portion with a bonding pad composed of the electric conductor pattern exposed from the insulating cover film. The pad portion has higher rigidity than the circuit portion.

Printed circuit board and method of producing printed circuit board

A camera module, which is mounted on an inside of a front windshield of a vehicle and to image an external environment of the vehicle, includes a lens unit and an imager to image the external environment by forming an optical image, which is from the external environment through the lens unit.

Camera module

Vehicle windshield mounted camera module

A camera apparatus is mounted to a vehicle. The camera apparatus includes a camera module, a casing, and a restraining portion. The camera module includes a lens and a camera board on which an image sensor is provided. The casing houses the camera module. The restraining portion is configured to mechanically restrain movement of the camera module that is mounted in a predetermined mounting position within the casing, from the mounting position. The camera module is fixed to the casing by an adhesive.

Camera apparatus for vehicle and manufacturing method for camera apparatus for vehicle

A camera module is mountable to an inner side of a front windshield of a vehicle and is configured to capture an image of an external environment of the vehicle. The camera module includes an optical assembly, a camera casing, and an adhesive. The optical assembly includes an assembly reference surface for determining the position of an optical axis and captures an image of the external environment by forming an optical image incident along the optical axis from the external environment. The camera casing includes a casing reference surface to be positioned with respect to the front windshield on the outside of the camera casing and accommodates the optical assembly in a state separate from inner wall surfaces. The adhesive joins the optical assembly to the camera casing in a state in which the assembly reference surface is aligned with an imaginary plane extending along the casing reference surface.

An in-vehicle camera control device is provided for an in-vehicle camera that includes an imaging element for picking up an image around the vehicle. The apparatus controls a state of current supply to the imaging element. In the apparatus, current supply to the imaging element is prevented from starting when the temperature in the vicinity of the imaging element is high. Specifically, upon start of processing, current supply to the imaging element of the in-vehicle camera is stopped first (camera is powered OFF). Therefore, at least immediately after the ignition is turned on, current supply to the imaging element is not performed. When a state where a temperature measured by a temperature measurement section provided in the vicinity of the imaging element is not more than an ON threshold continues for a duration expressed by Ams&#xd7;(startup counter value), current supply to the imaging element is started.

In-vehicle camera control device

In a camera apparatus, a camera case is fixed to a windshield from within a cabin of a vehicle. A camera module includes an optical unit and a camera substrate. The optical unit includes a lens. The camera substrate includes an image sensor. The optical unit includes a lens barrel portion and a base portion. The lens barrel portion holds the lens therein. The base portion has a reference surface that serves as a reference for positioning when the camera module is fixed to the camera case and to which the lens barrel portion is fixed so as to have a fixed positional relationship. The camera substrate is fixed to the optical unit in a position in which an optical axis of the lens passes through a center of a light receiving surface of the image sensor and is perpendicular to the light receiving surface of the image sensor.

Camera apparatus and camera module

A camera device which includes a holder which retains an optical member therein and a circuit board on which an image sensor is mounted. The holder is joined to the circuit board using an adhesive agent. The circuit board at least partially includes a metallic layer and a resinous layer stacked in a thickness-wise direction of the circuit board. The circuit board has a metallic layer-absent portion in which the metallic layer is partially omitted. The metallic layer-absent portion is located so as to overlap the joint between the holder and the circuit board in the thickness-wise direction of the circuit board, thereby minimizing the transfer of heat of the adhesive agent to the metallic layer. This achieves effective hardening the adhesive agent, which will facilitate the ease with which the camera device is assembled.

Camera device

An imaging apparatus provided with a lens module which has a main body and two vane members. The main body holds a lens on an inside thereof. The vane members are plate shaped sections projected from an outside surface of the main body, which are provided with through-holes enabling fastening members to be threaded through. A base is provided with an imaging element and configured to fix thereto the main body. The case which accommodates the lens, the lens module and the base has two thread-holes formed on an inside thereof, into which the fastening members are fastened thereto. The lens module is fixed to the case by threading the fastening members through the through-holes, and fastening the fastening members into the thread-holes.

Imaging apparatus

A camera device includes a holder in which an optical member is retained and a circuit board with an image sensor. The circuit board at least includes a stack of a solder resist, a metallic layer, and a resinous layer. A groove or recess is formed in the circuit board to have a depth extending through thicknesses of the solder resist and the metallic layer to expose a portion of an outer surface of the resinous layer. The holder is attached to the exposed portion of the outer surface of the resinous layer using an adhesive agent. An overflow stopper is formed at least round the recess to stop the adhesive agent from flowing outside the recess during a production process, thereby enhancing the degree of joining of the holder and the circuit board, and ensuring the stability in positional relation between the image sensor and the optical member.

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Kariya, Japan

Soji Masui