Rca Inc.

Soitiro Tosima

Shigeo Harada

Masayoshi Nishikawa

The present method can determine the presence and amount of silvery white metallic impurities in a silvery white molten solder composition. In accordance with the method of this invention, a transparent substrate which has sequential layers of metal deposited on one of the surfaces thereof is prepared. A first layer is formed directly on the substrate of a thin film of a colored metal such as copper or gold. A second thicker layer of a silvery white metal, the presence and amount of which is desired to be evaluated in the solder composition, deposited over the first layer. In use, the substrate is placed in contact with the molten solder. The amount of time required for the second layer to dissolve into the solder bath and the exposed first colored layer to change color due to alloying with the metal of the solder, is measured. The time required for the color change to occur is correlated to the level of contamination of the silvery white metal in the solder bath.

Method for characterizing solder compositions

A surface acoustic wave recording device is constructed for use in recording video signals in the surface of a master substrate. The device includes a pyramidal-shaped tip having a plurality of transducer electrodes for launching surface acoustic waves on the surfaces of the device structure. Surface acoustic waves launched from the plurality of transducers are focused at the apex of the record device. A stylus, for example, of diamond, affixed to the apex of the pyramidal structure vibrates in consonance with the signal to be recorded to cut the video signals into the surface of the master substrate.

Surface acoustic wave device having a pyramid shaped tip for recording

A test procedure is disclosed for evaluating the solderability properties of molten solder. In the method of this invention, a testpiece is provided which has a transparent support with a film of metal such as copper deposited on one surface of the transparent support. The surface having the metal film is immersed in the molten solder and the time required for alloying to occur and be observed through the transparent support is measured to determine rate of alloying and, thereby, the solderability properties of the molten solder under evaluation.

Method for the evaluation of solderability

A surface acoustic wave (SAW) pickup and record stylus is constructed from an elongated substrate which supports the propagation of SAW. The substrate is tapered to a tip at one end and a fan-shaped interdigital electrode structure having curved fingers is formed thereon. During operation in the pickup mode a beam of SAW is focused to the tip of the stylus which is arranged in contact with a record medium. During playback, the beam reflected by the record medium generates a signal in the interdigital electrode of the stylus representative of the acoustic conditions at the stylus tip and, correspondingly, of the information recorded on the record medium surface. In the record mode the stylus is brought into contact with a record medium. During recording, the input power applied to the interdigital electrode is increased to effect a deformation of the surface of the record medium representative of the information to be recorded.

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Machida, Japan

Soitiro Tosima