Rohm Co., Ltd.

Soichiro Takahashi

Masashi Hayashiguchi

Yoshihisa Tsukamoto

Masaaki Matsuo

Takumi Kanda

Yoshitoki Inami

Kaito Inoue

Kenji Hayashi

Akihiro Suzaki

Kenichi Onodera

A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.

Semiconductor device

A power module includes a mount layer, a control layer, and a drive layer that are formed on an electrically insulative substrate and multiple power semiconductor elements mounted on the mount layer in one direction and each including a first drive electrode connected to the mount layer, a second drive electrode connected to the drive layer, and a control electrode connected to the control layer. A control terminal is connected to the control layer and a detection terminal is connected to the drive layer. At least one of the control layer and the drive layer includes a detour portion that detours to reduce a difference between the power semiconductor elements in a sum of a length of a first conductive path between the control electrode and the control terminal and a length of a second conductive path between the second drive electrode and the detection terminal.

Power module

The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers. The electroconductive coupling members are connected to the first and second mounting layers. The switching elements are mounted on the first and second mounting layers. Each of the electroconductive coupling members has strip sections and a connecting section. The strip sections extend in the first direction and are spaced in a second direction crossing the thickness direction and the first direction. The connecting section extends in the second direction to interconnect the strip sections. The strip sections are connected at one end to the first mounting layer and connected at another end to the second mounting layer.

A first power supply terminal P is provided with an internal wiring connection portionA, an upright portionB which is joined to the internal wiring connection portionA, an inclined portionC which is joined to the upright portionB and an external wiring connection portionD which is joined to the inclined portionC. A second power supply terminal N is provided with an internal wiring connection portionA, an upright portionB which is joined to the internal wiring connection portionA, an inclined portionC which is joined to the upright portionB and an external wiring connection portionD which is joined to the inclined portionC. The upright portionB of the first power supply terminal P and the upright portionB of the second power supply terminal N are arranged so as to face each other, with a predetermined interval kept therebetween.

Growing community of inventors

Kyoto, Japan

Soichiro Takahashi