Canon Kabushiki Kaisha

Soichiro Nagamochi

Souta Takeuchi

Takuya Hatsui

Kenji Takahashi

Shuichi Tamatsukuri

Hirokazu Komuro

Yuzuru Ishida

Takeru Yasuda

Makoto Sakurai

Shinya Iwahashi

Mineo Shimotsusa

Sadayoshi Sakuma

Kazuaki Shibata

Toshio Negishi

Takeshi Aoki

Yasuhiro Soeda

An element substrate comprises a plurality of stages of shift registers that inputs and holds a serial data signal; a latch circuit that latches the serial data held by the shift registers; a decoder circuit that inputs an output of the latch circuit and outputs a selection signal for selecting a block of the print elements or the memory elements; and a mask circuit that masks the output of the selection signal for selecting the block of the memory elements from the decoder circuit in accordance with an input bit data signal. The block of the print elements or the memory elements includes a plurality of print elements or memory elements in which one element is selected in each of the plurality of groups.

Element substrate, liquid discharge head, and printing apparatus

A highly reliable multilayer structure element substrate according to an embodiment of this present invention comprises: an electrothermal transducer; a temperature detection element formed at a position where the temperature detection element at least partially overlaps the electrothermal transducer in a planar view of the element substrate; and a plurality of wirings connected to the temperature detection element, wherein the temperature detection element can detect temperatures in a plurality of regions when a plurality of different wirings out of the plurality of wirings are selected.

An element substrate has a layered structure including a heating resistance element, a first insulation layer where a temperature detection element constituted by a via is formed, and a second insulation layer provided between the heating resistance element and the temperature detection element which electrically insulates the heating resistance element and the temperature detection element.

Element substrate, liquid ejection head, and method of manufacturing element substrate

A liquid-discharging-head substrate includes an insulation layer, an electrode, and a heating resistor element, wherein the insulation layer includes a first opening portion including a first opening formed in a surface of the insulation layer, a second opening having a smaller opening area than an opening area of the first opening, and a surface connecting the first opening and the second opening, and a second opening portion extending from the second opening to a back surface of the insulation layer, wherein the electrode is formed in the second opening portion, and a surface of the electrode is exposed from the second opening when viewed from the surface side of the insulation layer, and wherein the heating resistor element is in contact with the surface connecting the first opening and the second opening, and with the surface of the electrode.

Liquid-discharging-head substrate, liquid discharging head, liquid discharging apparatus, method of manufacturing liquid-discharging-head substrate

A liquid discharge head substrate comprising a liquid discharge element arranged above a surface of a substrate, an insulator arranged between the surface and the liquid discharge element, a liquid supply port extending through the insulator, first and second conductive patterns is provided. The first pattern connects an element arranged on the surface and the liquid discharge element. The second pattern surrounds the liquid supply port. The insulator includes first and second films that are bonded at a bonding surface along the surface. A first member arranged in the first film and a second member arranged in the second film, of the first pattern, are bonded at the bonding surface. A third member arranged in the first film and a fourth member arranged in the second film, of the second pattern, are bonded at the bonding surface.

Liquid discharge head substrate, liquid discharge head, and liquid discharge apparatus

Provided is a liquid ejection head substrate having a base, a heat generating resistor layer formed on or above the base and including an electrothermal conversion portion, a wiring electrically connected to the heat generating resistor layer and defining the electrothermal conversion portion and a protecting film covering at least the electrothermal conversion portion and the wiring of the heat generating resistor layer. In the liquid ejection head substrate, the wiring is made of an alloy containing Al as a main component and Cu and having an average crystal grain size of 300 nm or less.

Liquid ejection head substrate, method of manufacturing same and liquid ejection head

A liquid ejection head including a substrate, an energy generating element provided on the substrate, a film provided on the substrate and the energy generating element, and a flow path forming member provided on the substrate, forming a flow path of a liquid between the flow path forming member and the substrate, and having an ejection orifice at a position faced with the energy generating element, characterized in that the substrate has a supply path of the liquid communicating with the flow path, the flow path forming member has a structure protruding toward the supply path, and a peripheral shape of a distal end portion of the structure is a curved surface shape.

Liquid ejection head and manufacturing method thereof

A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.

Method for manufacturing liquid ejection head substrate

Even if electrostatic discharge occurs, dielectric breakdown of an insulating layer for covering an element on a base substrate is inhibited. A substrate for an ink jet recording head includes: a base substrate including an element configured to apply energy for ejecting ink to ink and an insulating protective layer for covering the element; an ejection orifice forming member including an insulating first member for forming an ink flow path for supplying ink to the element and a second member including an ejection orifice surface having ejection orifices provided therein; and a columnar conductive member extending between the second member and the base substrate in a direction intersecting the ejection orifice surface.

Substrate for ink jet recording head

An element substrate including a base having a heat-generating resistor element which generates thermal energy used for discharging a liquid; an electrically conductive protective layer covering the heat-generating resistor element; an insulating layer provided between the heat-generating resistor element and the protective layer; and a potential applying unit for applying a potential to the protective layer such that a potential of the protective layer is lower than a potential at one end of the heat-generating resistor element and higher than a potential at the other end of the heat-generating resistor element with a voltage being applied between the one end and the other end of the heat-generating resistor element.

Element substrate and method for discharging liquid

An inkjet printhead substrate includes a base plate, a heat storage layer placed on the base plate, a heat-generating resistive layer which is placed on the heat storage layer and which includes an electrothermal transducing portion, a wiring layer electrically connected to the heat-generating resistive layer, and an insulating protective layer covering the heat-generating resistive layer and the wiring layer. The heat storage layer includes a porous cyclic silazane film formed by a vapor phase process.

Inkjet printhead substrate, method of manufacturing the same, and inkjet printhead

An ink jet recording head substrate is provided which includes a base substrate, a heat accumulation layer overlying the base substrate, a heating resistor layer including an electrothermal conversion portion and overlying the heat accumulation layer, a wiring layer electrically connected to the heating resistor layer, and an insulating protective layer covering the heating resistor layer and the wiring layer. The heat accumulation layer includes a porous cyclic siloxane film.

Ink jet recording head substrate, method for manufacturing the same, and ink jet recording head

The invention provides a liquid ejection head including a member in which an ejection orifice for ejecting a liquid is formed, and a substrate to which the member is joined. The substrate has a heat storage layer containing a silicon compound and an energy-generating element provided at a position corresponding to the ejection orifice for generating heat by electrification to eject the liquid from the ejection orifice. The energy-generating element has a laminate having a metal layer formed of tantalum or tungsten, an Si layer laminated on the metal layer and formed of silicon and an N layer laminated on the Si layer and formed of nitrogen, and the metal layer is in contact with the heat storage layer.

Process for producing liquid ejection head and process for producing substrate for liquid ejection head including repeated metal layer, Si layer, N layer laminations

The reduction in reliably of a liquid discharge head due to the dissolution of a protective layer is suppressed. A substrate for a liquid discharge head includes a base substrate, a heat-generating resistive layer placed on the base substrate, a pair of lines placed on the base substrate, and a protective layer covering the heat-generating resistive layer and the lines. The protective layer contains a material represented by the formula SiCN, where x+y+z=100, 30&#x2266;x&#x2266;59, y&#x2267;5, and z&#x2267;15 on an atomic percent basis.

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Kawasaki, Japan

Soichiro Nagamochi