Goo Chemical Company, Ltd.

Goo Chemical Industries Co., Ltd.

Soichi Hashimoto

Toshikazu Oda

Koichi Yoshioka

Nobuhito Hamada

Satoshi Miyayama

Fumito Suzuki

Hiroko Daido

Tatsuya Kubo

Masahiro Mizushima

Toshiaki Nishimura

Masatoshi Fujimoto

An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating. This resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy-group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group to obtain an intermediate product, and then reacting the intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in its molecule; (C) a photo-polymerization initiator; (D) a diluent; and (E) an ultraviolet curable resin obtained by reacting a novolac epoxy compound (e) with the ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with the saturated or unsaturated polybasic acid anhydride (c). The ultraviolet curable resin (E) has an acid value of 10 mgKOH/g or more and less than 45 mgKOH/g.

Ultraviolet curable resin composition and photo solder resist including the same

An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

An ultraviolet curable resin composition includes (A) an ultraviolet curable resin, (B) an epoxy compound having at least two epoxy groups in one molecule, (C) a photopolymerization initiator and (D) a diluent. The ultraviolet curable resin (A) is obtained by the steps of polymerizing an ethylenically unsaturated monomer component containing (a) an ethylenically unsaturated monomer having epoxy group and (b) a compound having at least two ethylenically unsaturated groups in one molecule to prepare a copolymer, reacting the copolymer with (c) an ethylenically unsaturated monomer having carboxyl group to prepare a chemical intermediate, and reacting the chemical intermediate with (d) one of saturated and unsaturated polybasic acid anhydrides. This resin composition will be preferably used to prepare a photo solder resist ink developable with diluted alkaline aqueous solution.

Ultraviolet curable resin composition and photo solder resist ink using the same

An ultraviolet-curable type photo solder resist ink comprises the following components (A) to (E). That is. the component (A) is an ultraviolet-curable resin having at least two ethylenically unsaturated groups and a carboxyl group per one molecule thereof. The component (B) is an epoxy compound having at least two epoxy groups per one molecule thereof. The component (C) is at least one selected from a compound having at least one carboxyl group and a polycarboxylic acid anhydride. The component (D) is a photopolymerization initiator. The component (E) is a diluent. This photo solder resist ink shows a good developing property even when a developer having a pH value of about 10 is used, and is excellent in a storage stability of resist, electrical corrosion resistance, electric performance, chemical resistance, plating resistance, heat resistance to solder, adhesion, and pencil hardness.

Ultraviolet-curable type photo solder resist ink

An ultraviolet-curable and alkali-developing type photo solder resist ink comprises an epoxy resin obtained by extending chains of an epoxy compound by an isocyanate compound having at least two isocyanate groups per one molecule of the isocyanate compound, an ultraviolet-curable resin having carboxyl group and an ethylenically unsaturated group having a photopolymerization capability, a photopolymerization initiator, and a diluent. The resist ink shows a wide precuring acceptable width for providing an extended shelf life, a good tacky-dry property after a precuring step, excellent light-sensitivity at an exposing step, superior resolution, and improved removability of a film of the resist ink by an alkaline solution at a developing step. In addition, a solder resist obtained by a post-baking step of the resist ink film provides excellent resistances to molten solder and gold plating.

Ultraviolet-curable and alkali-developing type photo solder resist ink

Photosensitive solder resist ink, printed circuit board and production

A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.2 equivalents, relative to one epoxy equivalent of said copolymer, of (meth)acrylic acid and a saturated or unsaturated polybasic acid anhydride; a photopolymerization initiator; a diluent; and a thermosetting epoxy compound.

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Kyotanabe, Japan

Soichi Hashimoto