Samsung Electronics Co., Ltd.

Sohyeon Bae

Jaehyuk Jang

Jaehyun Kim

Wonchul Lee

Hyebin Choi

A method of manufacturing a semiconductor device including partially etching an upper portion of a substrate to form a recess extending in a first direction parallel to an upper surface of the substrate, forming a gate structure in the recess, the gate structure including a first conductive pattern, a second conductive pattern on the first conductive pattern, and a gate mask on the second conductive pattern, partially etching an end portion of the gate structure in the first direction to form an opening, the opening extending through end portions of the gate mask and the second conductive pattern of the gate structure to expose a portion of the first conductive pattern, and a bottom of the opening being lower than a lower surface of the exposed portion of the first conductive pattern, and forming a contact plug in the opening.

Semiconductor devices

A semiconductor device includes a gate structure and a contact plug. The gate structure extends in a first direction parallel to the substrate, and includes a first conductive pattern, a second conductive pattern and a gate mask sequentially stacked. The contact plug contacts an end portion in the first direction of the gate structure, and includes a first extension portion extending in a vertical direction and contacting sidewalls of the gate mask and the second conductive pattern, a second extension portion under and contacting the first extension portion and a sidewall of the first conductive pattern, and a protrusion portion under and contacting the second extension portion. A bottom of the protrusion portion does not contact the first conductive pattern. A first slope of a sidewall of the first extension portion is greater than a second slope of a sidewall of the second extension portion.

Growing community of inventors

Seoul, South Korea

Sohyeon Bae