Sioptical, Inc.

Cisco Technology, Inc.

Aayuna Inc.

Other

Lightwire, Inc.

Nsv LLC

Saras-3d, Inc.

Gothoskar, Prakash

Ghiron, Margaret

Montgomery, Robert Keith

Pathak, Soham

Patel, Vipulkumar

Shastri, Kalpendu

Yanushefski, Katherine A.

Piede, David

Soham Pathak

Kalpendu Shastri

Vipulkumar K Patel

Prakash B Gothoskar

Robert Keith Montgomery

Margaret Ghiron

Katherine A Yanushefski

Bipin Dama

Kishor V Desai

Ravinder Kachru

Rao Yelamarty

David Piede

Utpal Kumar Chakrabarti

Neeraj Kumar Dubey

Anujit Shastri

Alan Leonhartsberger

Mark Andrew Webster

Thomas Robert Daugherty

Kaushik Patel

Jeremy Lim

Gnyaneshwar Ramakrishna

Neha Kumar

Ankita Shastri

Rutvij Dave

Chris Togami

Paulius Mosinskis

John Matthew Fangman

Harvey L Wagner

Sharvari Harsh Dalal

Terry Ki Lim

Vipulkumar Patel

Prakash Gothoskar

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC (PIC) is provided by a controlled mating between alignment V-grooves formed in a fiber array support substrate and extra-array alignment ridges formed beyond the extent of a waveguide array integrated within the PIC. The height and width of the alignment ridges are formed to engage with the alignment V-grooves upon mating of the fiber array substrate with the PIC, providing passive alignment while maintaining a physical gap spacing g between the components (ensuring the integrity of the passive alignment).

Passively-aligned fiber array to waveguide configuration

A hand-held vision sensor apparatus comprises a plurality of light sources, control activation elements and an image sensing array, encased within a housing such that the control activation elements are disposed at a user-accessible location on the housing. The housing further includes a pair of exit apertures for emitting illumination directed toward a medical specimen and an entrance aperture for capturing reflected light from the medical specimen. The light sources are disposed in alignment with the pair of exit apertures, and the image sensing array is aligned with the entrance aperture. The control activation elements are utilized to energize the light sources and control the functioning of the image sensing array. A computer port may be included and used to communicate command controls to the light sources, image sensing array and control activation elements in a manner that allows for a remotely-located technician to communicate with the hand-held vision sensor.

Vision sensor apparatus for medical diagnostic applications

A colposcopy instrument (which includes a display screen) is controlled by a specific set of steps defined in software to follow a defined protocol for performing a colposcopy examination. The software is utilized to also control the features of an included camera so that consistent digital images are recorded. The integrated software prompts the medical personnel performing the colposcopy procedure to capture relevant images in an automated sequence that includes, for example, capturing a sequence of images after the application of the acetic acid to the cervix. The displayed user interface guides the individual performing the exam through a series of easy-to-understand screen prompts to capture specific, critical images during the exam. The process, once begun, is automated and does not require the individual performing the exam to make any decisions about whether or not to record a certain image.

Automated process for controlling in vivo examination of the cervix and collecting image data related thereto

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC is provided by a controlled mating between V-grooves formed in a fiber support substrate and alignment ridges formed to surround waveguide terminations along an edge of a photonic IC. The V-grooves of the fiber support substrate are spaced to define the same pitch as the waveguides on the photonic IC, with the height and width of the alignment ridges formed to engage with the V-grooves upon mating of the fiber support substrate with the photonic IC. The individual fibers are positioned within associated V-grooves such that their endfaces are retracted from a proximal end portion of the support structure. It is this proximal end portion that mates with the alignment ridges on the photonic IC.

A 2D/3D conversion interface component is configured to override the video processing capabilities associated with a conventional 2D display, re-formatting an incoming 3D video stream into a version compatible with a 2D display while preserving the 3D-type of presentation. An incoming 'side-by-side' (SBS) 3D video stream is re-formatted into a 'frame sequential' (serialized) format that appears as a conventional video stream input to the 2D display. The interface component also generates as an output a timing signal (synchronized with the converted frames) that is transmitted to a 3D viewing device (e.g., glasses). Therefore, as along as the 3D viewing device remains synchronized with the sequence of frames shown on the 2D display, the user will actually be viewing an interactive 3D video.

User interface module for converting a standard 2D display device into an interactive 3D display device

A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon photonic-based circuitry for providing optical transceiver functionality. Passively aligned fiber arrays are utilized to provide I/O connections to external elements, as well as between laser sources and on-board silicon photonics.

High density opto-electronic interconnection configuration utilizing passive alignment

Embodiments herein include an optical system, an optical component, and an associated method of passive alignment in which complementary magnetic patterns are used to provide passive alignment between optical elements. The magnetic coupling between the magnetic patterns operates to align optical elements in at least two dimensions. The magnetic coupling provides a temporary holding force on the optical elements until the optical elements are secured using epoxy or other adhesive.

Alignment of optical components using nanomagnets

An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

Molded glass lid for wafer level packaging of opto-electronic assemblies

Embodiments herein include an optical system that passively aligns an optical component (e.g., a fiber array connector, lens array, lens body, etc.) with a semiconductor substrate using trenches that mate with optical fiber stubs. In one embodiment, the trenches are etched into the semiconductor substrate which provides support to optical devices (e.g., lasers, lens arrays, photodetectors, etc.) that transmit optical signals to, or receive optical signals from, the optical component. An underside of the optical component is etched to include at least two grooves (e.g., V-grooves) for receiving optical fiber stubs. In one embodiment, the optical fiber stubs are a portion of optical fiber that includes the core and cladding but not the insulative jacket. Once the fiber stubs are attached to the grooves, the fiber stubs are disposed into the trenches in the semiconductor substrate thereby passively aligning the optical component to the optical device on the substrate.

Passive alignment of optical components using optical fiber stubs

An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

Single mode fiber array connector for opto-electronic transceivers

A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a 'platform' (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

Wafer scale packaging platform for transceivers

An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.

Self-aligning optical connector assembly

An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.

Releasable fiber connector for opto-electronic assemblies

Techniques and configurations are provided for packaging optoelectronic devices. In particular, a lid component of an optoelectronic device is provided, and the lid component is configured to cover active components of the optoelectronic device. An optically transparent wall is also provided. The optically transparent wall is coated with an anti-reflective material and configured to interface with a section of the lid component. The optically transparent wall is joined with the section of the lid component such that the optically transparent wall and the lid provide a seal for the active components of the optoelectronic device. Additionally, the lid component has a top surface and a plurality of side surfaces that are coupled to the top surface. An optically transparent wall coated with an anti-reflective material adhesively joins to the top surface and one or more side surfaces.

Lid design to seal optical components of a transceiver module

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Allentown, PA, United States of America

Soham Pathak