3m Innovative Properties Company

3m Intellectual Property Company

Sohaib Elgimiabi

Frank Neuroth

Lianzhou Chen

Frans A Audenaert

Florian Szillat

Elisabeth Cura

Dmitriy Salnikov

Jay S Schlechte

Kotaro Shinozaki

Saori Ueda

Alain Henri Lamon

Stefan Spiekermann

Stefan Luebbe

Peter J Harrison

Nurettin Yavuz

Yaoyao Chen

Bernhard H Koch

Alain H Lamon

Cyrus Solidarios Manzo

Provided are two-part shimming adhesives comprising a base part and a hardener part that are curable upon mixing. The base part includes a multifunctional epoxy resin having an epoxide functionality of at least three, a difunctional epoxy resin miscibly blended with the multifunctional epoxy resin. The hardener part includes a polyetheramine. Either the base part or hardener part further comprises an inorganic filler present in an amount from 10 percent to 60 percent, relative to the overall weight of the two-part curable shimming adhesive, and a phosphoric acid ester. The shimming adhesive enables joints to be assembled in one step, providing a significant advantage to the user.

Shimming adhesive

A thermosettable precursor of an expanded structural adhesive composition comprising: an epoxy compound; an epoxy curing agent; an expanding agent; and a mineral pigment selected from the group of phosphate metal complexes. In addition, a method of bonding two parts and to uses of the thermosettable precursor of an expanded structural adhesive composition.

Thermosettable precursor of a structural adhesive composition with corrosion resistance

A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.

Room temperature stable one-part void filler

Provided is a curative part usable in a two-part curable composition. The curative part includes a liquid amine; a heterogeneous dispersant; and core-shell rubber particles having an elastomeric core and a (meth)acrylic shell. The core-shell rubber particles and the heterogeneous dispersant can be collectively shear-dispersed in the liquid amine such that the core-shell rubber particles are substantially non-aggregated and the curative part is phase-stable over a period of at least 3 months at ambient temperature. Advantageously, large amounts of core-shell rubber particles can thus be incorporated into a cured resin matrix, which can afford significantly enhanced impact performance.

Curable composition

A curable coating composition precursor comprising: (a) a first part (A) comprising (i) at least one amine epoxy curing agent based on a phenolic lipid, and (ii) inorganic microspheres; and (b) a second part (B) comprising (i) at least one epoxy resin, (ii) optionally, at least one reactive diluent, (iii) at least one epoxy reactive flexibilizer, and (iv) inorganic microspheres. The curable coating composition precursor comprises at least one fire retardant compound in part (A) and/or part (B), and the curable coating composition obtained by combining part (A) and part (B) has a density of less than 0.7 g/cm.

Thermal cycling resistant low density composition

The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.

Structural adhesive with improved corrosion resistance

The present disclosure provides a curable void filler composition comprising: (a) at least one epoxy resin; (b) at least one epoxy curing agent comprising a carboxylic acid anhydride compound; (c) at least one alkaline oxide and/or at least one alkaline earth oxide.

Hot/wet resistant low density epoxy compositions

The present disclosure is directed to a curable composition comprising: a) an epoxy resin; b) an epoxy curing agent comprising at least one cycloaliphatic amine; c) at least 3 wt % of a metal triflate catalyst; d) optionally, a fatty acid polyamide; and e) optionally, a filler material. The compositions of the present disclosure are particularly suitable for use in structural assembly, in particular for potting and filling operations in sandwich structures. The present disclosure also relates to a composite assembly and to methods of using such epoxy resin based curable compositions.

Rapid curing epoxy adhesive compositions

The invention relates to the use of a structural adhesive film for bonding and sealing a hem flange connection between panels. The structural adhesive film comprises at least one adhesive layer and at least one layer with a porous structure. The adhesive layer comprise an epoxy compound as well as an epoxy curing agent.

Multilayer structural adhesive film

Epoxy curatives and two-part compositions comprising epoxy curative and epoxy resin parts are provided as well as methods of their use in liquid shim applications. Epoxy curatives comprise at least one cycloaliphatic polyamine curative and at least one second curative selected from a) an aliphatic polyamidoamine and b) an adduct of an excess of an unbranched polyetherdiamine with an epoxy resin.

Two-part liquid shim compositions

Curable adhesive compositions comprising 

Epoxy adhesive compositions comprising an adhesion promoter

Use of a curable composition comprising at least one epoxy resin and at least one epoxy curative composition as a curable shim for filling gaps between two assembled parts of an assembly, wherein the epoxy curative composition comprises at least a first and a second curative wherein the first curative is selected from a cyclic amine having at least one primary amino (&#x2014;NH) group and a second curative selected from at least one polyether polyamine comprising at least one polyether unit and separated therefrom by a linking group at least one polyamine unit and further comprising at least one terminal aminoalkyl residue that is branched and comprises a primary amino group (&#x2014;NH) and an alkyl branch in an &#x3b1;-, &#x3b2;- or &#x3b3;-position to the primary amino group wherein the alkyl branch contains from 1 to 6 carbon atoms.

High modulus epoxy adhesives for shimming applications

Curable compositions are provided comprising (i) at least one epoxy resin as specified (ii) an epoxide hardener system comprising (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30 C to about 100 C and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50 C to about 180 C and having at least one primary amine group, wherein the first and second amines are selected such that they have a difference in melting points of at least 10 C and wherein the first and second amines are contained in minor amounts by weight as compared to the carboxylic acid anhydride; and (iii) a filler as specified. Also provided are compositions obtainable by curing the curable composition, the use of the curable composition for filling of voids in honeycomb structures and processes for filing voids in honeycomb structures.

Epoxy resin-based composition as a filler honeycomb cells

In accordance with the present invention there is provided a method of making a metal part assembly, the method comprising: &#x2014;providing a first metal part and a second metal part wherein at least one of the first and second metal part comprises a metal panel; &#x2014;providing an adhesive sheet having a first portion near a first end of the adhesive sheet and a second portion near a second end opposite to the first end of the adhesive sheet, the adhesive sheet comprising a thermosettable composition that comprises a mixture of a first and second epoxy compound and an epoxy curing agent, wherein the first epoxy compound has a weight average molecular weight of at least 1000 g/mol and has an amount of epoxy groups of between 5 and 10 mole % and the second epoxy compound has a weight average molecular weight of not more than 400 g/mol and wherein the weight ratio of first to second epoxy compound is between 0.8 and 4; &#x2014;adhering said first and second metal part together such that the adhesive sheet is provided between said first and second metal part thereby forming a metal joint; and heating the metal joint so as to cause thermosetting of the thermosettable composition of the adhesive sheet.

Metal panel assembly and method for making same

A curable precursor composition for preparing a vibration dampening composition having a density of less than 0.9 g/cmsaid precursor composition comprising Also provided are vibration dampening compositions obtainable from the precursor compositions and methods of preparing such vibration dampening compositions.

Growing community of inventors

Dusseldorf, Germany

Sohaib Elgimiabi