Cpt Group Gmbh

Continental Automotive Gmbh

Vitesco Technologies Gmbh

Soeren Rittstieg

Thomas Schmid

Arnoud Smit

Erich Mattmann

Lars Keller

Roland Brey

Sabine Bergmann

A circuit carrier for holding at least one electrical power component is disclosed. The circuit carrier including a heat sink for holding and for cooling the power component. The heat sink having a surface. The circuit carrier includes a copper layer for mechanically connecting the heat sink to at least one copper plate, where the copper layer includes copper or a copper alloy and is cold-gas-sprayed or sintered on the surface of the heat sink. The circuit carrier also includes at least one copper plate for mechanically and electrically connecting the power component to the copper layer. The copper plate includes copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer.

Power electronics assembly including a circuit carrier

A cooling device includes an aluminum heat sink and at least one nickel sheet segment. The nickel sheet segment is connected to the aluminum heat sink by a solder layer. The cooling device includes a securing surface for securing and for heat absorption. The securing surface being formed by that side of the nickel sheet segment which faces away from aluminum heat sink. The aluminum heat sink is formed from a plurality of aluminum sheets which are stacked one above another and are connected to one another. At least one aluminum sheet includes cutouts which form a cooling channel covered by at least one of the aluminum sheets. Furthermore, a method for producing a cooling device and also a power circuit comprising a heat sink as described here are presented.

Aluminum heat sink having a plurality of aluminum sheets and power device equipped with the heat sink

Cooling device, method for producing a cooling device and power circuit

The present disclosure relates to cooling devices. The teachings thereof may be embodied in methods for producing cooling devices and power circuits equipped with a cooling device. Embodiments may include cooling device having an aluminum cooling element; and at least one nickel metal sheet connected to the aluminum cooling element by a solder layer; wherein the cooling device includes a mounting surface formed by a side of the at least one nickel metal sheet facing away from the aluminum cooling element.

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Neutraubling, Germany

Soeren Rittstieg