Te Connectivity Germany Gmbh

Te Connectivity Corporation

Tyco Electronics Corporation

Tyco Electronics (shanghai) Co., Ltd.

Te Connectivity Solutions Gmbh

Soenke Sachs

Helge Schmidt

Michael Leidner

Felix Greiner

Eva Henschel

Volker Seipel

Marjorie Kay Myers

Dominique Freckmann

Yiliang Wu

Lei Wang

Ting Gao

Xiao Zhou

Dejie Tao

Martin Listing

Uwe Bluemmel

Christoph Kosmalski

Jochen Fertig

Maximilian Veihl

Marco Wolf

Bernd Leonhardt

Maik Schaefer

Jochen Brandt

Christian Gregor

Ivan Ivanov

Gokce Gulsoy

Shallu Soneja

Viktor Holzmann

Jürgen Sauer

Christian Walter Gregor

A dispensable grease sealant includes a base component in an amount of 50 wt % or more, based on a total weight of the sealant, and a thickener. The base component is selected from a group including a silicone wax, a liquid rubber, and a combination thereof.

Dispensable grease sealants, method for producing same, crimp connection, method for producing same, and use of the dispensable grease sealants

A shielding spring shell has a contact tab with a pair of spring sections adjoining a fillet. One of the spring sections is an at least radially resilient radial spring and another of the spring sections is an at least axially resilient axial spring.

Shielding spring shell for high current plug-in connections

A socket contact includes a receptacle receiving a plug contact, a base body surrounding the receptacle at least in sections, a contact element disposed in the receptacle and contacting the plug contact, and a spring device creating a contact normal force at the contact element. The spring device is formed as a part of the base body that surrounds the contact element. The spring device is arranged at a first part and the contact element is arranged at a second part separate from the first part.

Socket contact having spring device

A crimp contact for crimping a conductor includes a crimp flank and a receptacle receiving the conductor and extending in a longitudinal direction of the crimp contact up to a receiving end. The crimp flank extends in the longitudinal direction over the receiving end up to a front end. The crimp flank encloses the conductor after crimping. The crimp contact has a structured region in a front region of the crimp contact arranged between the receiving end and the front end.

Crimp contact with structured region for preventing conductor slippage during crimping

A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.

Aluminum based solderable contact

The invention relates to a method for producing at least one functional region on an electrical contact element such as, for example, a switching contact or a plug type contact. In order to prevent the high environmental burden which is disadvantageous in wet-chemical methods and to overcome the restriction to a very small number of materials caused in hot dip methods in physical technical terms, and to substantially improve the spatial possibility for selection and structuring which is insufficient in both techniques, there is provision according to the invention for at least one material coating to be applied mechanically in a highly selective manner to the contact element in the functional region and subsequently highly energetic thermal radiation such as, for example, a particle beam in the form of an ion and/or electron beam, to be directed onto the at least on material coating.

Method for manufacturing at least one functional area on an electric contact element such as a switching contact or a plug contact

An electrical contact comprises an electrically conductive contact material and a plurality of particles adhered to an area of the contact material. At least some of the particles have a portion penetrating into the contact material.

Electrical contact element and method for altering mechanical and/or electrical properties of at least one area of such

A connection device for producing a crimped connection comprises a deformation device and a friction body. The crimped connection includes a crimp sleeve and a conductor. The deformation device is adapted to plastically deform the crimp sleeve around the conductor. The friction body is adapted to be moved into abutment with the crimp sleeve and adapted to be movably driven while remaining in abutment with the crimp sleeve.

Method and connection device for producing a crimped connection

A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.

Electrical components and methods and systems of manufacturing electrical components

A method for producing an electrical component is provided. The method includes steps of providing a continuous strip material and separating a section from the continuous strip material using an electron beam.

Electron-beam-supported production of electrical components

An electrical contact element is disclosed. The electrical contact element includes a contact surface of an electrically conductive contact body having a plurality of coated regions with a first coating and a plurality of uncoated regions without the first coating, the coated regions and uncoated regions arranged in an alternating manner in a variation direction along the contact surface.

Electrical contact element with a finely structured contact surface

A method of manufacturing a coated structure on a substrate includes positioning a substrate in a vapor deposition chamber having a crucible with source material. The method includes evaporating the source material with electron beams from an irradiation source, the evaporated source material being deposited on the substrate as a coating layer. The method includes ablating the coating layer with the electron beams to selectively remove portions of the coating layer leaving a circuit structure on the substrate. The evaporating and ablating are accomplished in situ within the vapor deposition chamber using the same irradiation source.

Methods of manufacturing a coated structure on a substrate

The invention relates to a method for producing at least one functional region () on an electrical contact element () such as, for example, a switching contact or a plug type contact. The at least one functional region (), for example, a contact location or a connection region for crimping or soldering connections is limited to a partial area of the contact element. In order to prevent the high environmental burden which is disadvantageous in wet-chemical methods and to overcome the restriction to a very small number of materials caused in hot dip methods in physical technical terms, and to substantially improve the spatial possibility for selection and structuring which is insufficient in both techniques, there is provision according to the invention for at least one material coating () to be applied mechanically in a highly selective manner to the contact element in the functional region () and subsequently highly energetic thermal radiation () such as, for example, a particle beam in the form of an ion and/or electron beam, to be directed onto the at least one material coating (). The material coating () can contain new materials or material combinations which cannot be provided by previous methods. The invention further relates to a device for producing such a functional region and a contact element having such a functional region (), the contact element () being produced in accordance with the above method.

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Frankfurt am Main, Germany

Soenke Sachs