Infineon Technologies Ag

Sock Chien Tey

Chan Lam Cha

Cher Hau Danny Koh

Wern Ken Daryl Wee

Si Hao Vincent Yeo

Mei Yong Wang

Chau Fatt Chiang

Norliza Morban

Khay Chwan Andrew Saw

Fortunato Lopez

Hoe Jian Chong

Desmond Jenn Yong Loo

Ying Dieh Cheong

Kim Guan Tan

Swee Kat Lee

A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.

Semiconductor packages and methods for manufacturing thereof

A packaged semiconductor device includes a carrier having a die attach surface, a semiconductor die mounted on the die attach surface and comprising first and second conductive terminals disposed on an upper side, a first clip that extends over the semiconductor die and is electrically connected to the first conductive terminal, a second clip that extends over the semiconductor die and is electrically connected to the second conductive terminal, and an electrically insulating encapsulant body that encapsulates the semiconductor die. An outer end of the first clip is exposed from the encapsulant body and provides a point of external electrical contact for the first conductive terminal. An outer end of the second clip is exposed from the same or a different side face of the encapsulant body as the first clip and provides a point of external electrical contact for the second conductive terminal.

Quad package with conductive clips connected to terminals at upper surface of semiconductor die

A semiconductor package includes a substrate, a semiconductor die, dendrite, and a mold material. The substrate includes a die pad. The die pad includes roughening features. The semiconductor die is attached to the die pad such that the roughening features are adjacent to the semiconductor die. The dendrite is on the roughening features adjacent to the semiconductor die. The mold material encapsulates the semiconductor die, the dendrite, and at least a portion of the substrate.

Semiconductor packages including roughening features

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Melaka, Malaysia

Sock Chien Tey