Samsung Electro-mechanics Co., Ltd.

So Yeon Song

Soo Hwan Son

Byeong Cheol Moon

Young Il Lee

Sung Yong An

Ic Seob Kim

Heung Kil Park

Myeong Gi Kim

Soon Ju Lee

Jin Woo Hahn

Seok Kyoon Woo

Min Kyoung Cheon

Yu Jin Choi

Kyoung Jin Jun

Sang Soo Park

Young Ghyu Ahn

Ho Yoon Kim

Ho Young Kim

Myeong Gil Kim

Sung Lyoung Kim

Jeong Wook Kim

An inductor is provided including a multilayer body in which a plurality of magnetic layers containing a ferrite are laminated. A coil part including a plurality of conductive patterns is disposed in the multilayer body. External electrodes are electrically connected to the coil part. The ferrite may contain iron (Fe), manganese (Mn), nickel (Ni), zinc (Zn), and vanadium (V), and the ferrite may contain 40 to 55 mol % of iron (Fe) calculated as iron oxide (FeO), 5 to 20 mol % of nickel (Ni) calculated as nickel oxide (NiO), 15 to 25 mol % of zinc (Zn) calculated as zinc oxide (ZnO), 15 to 30 mol % of manganese (Mn) calculated as manganese oxide (MnO), and 1 to 4 mol % of vanadium (V) calculated as vanadium oxide (VO).

Ferrite and inductor including the same

A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.

Multilayer electronic component, manufacturing method thereof, and board having the same mounted thereon

A multilayer electronic component may include a multilayer body including a plurality of magnetic material layers, and an internal electrode disposed in the multilayer body. The internal electrode may contain a conductive metal and glass, and the glass contains a vanadium (V) oxide. Also, a conductive paste composition for an internal electrode includes a conductive metal and glass, wherein the glass contains a vanadium (V) oxide.

Multilayer electronic component and conductive paste composition for internal electrode

A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes having respective dielectric layers interposed therebetween, and first and second external electrodes respectively including first and second connection portions, and first and second band portions extended from the first and second connection portions, and first and second metal frames respectively including first and second upper horizontal portions, first and second lower horizontal portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions, respectively.

Multilayer ceramic component having metal frames connected to external electrodes thereof and board having the same

There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor (MLCC) including first and second external electrodes disposed to be spaced apart from one another on a mounting surface thereof; and first and second terminal electrodes including upper horizontal portions disposed on lower surfaces of the first and second external electrodes, lower horizontal portions disposed to be spaced apart from the upper horizontal portions downwardly, and curved vertical portions connecting one ends of the upper horizontal portions and one ends of the lower horizontal portions, having '&#x2282;' and '&#x2283;' shapes, and disposed on the mounting surface of the MLCC in a facing manner.

Multilayer ceramic electronic component and board having the same

A multilayer ceramic component including a multilayer ceramic capacitor including first and second external electrodes disposed on a mounting surface of a ceramic body; and first and second terminal electrodes each including an upper horizontal part disposed on a lower surface of the respective external electrode, a lower horizontal part disposed below the upper horizontal part and spaced apart from the upper horizontal part, and a connecting part connecting the upper horizontal part and the lower horizontal part, the connecting part having a plurality of openings alternately facing opposite end surfaces of the ceramic body.

Multilayer ceramic component and board having the same

There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40&#x2266;Ai:Ao&#x2266;1.03 is satisfied.

Multi-layered chip electronic component

A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.

Composite electronic component and board having the same

Disclosed are a multilayered power inductor, including: a body in which a plurality of magnetic layers formed with inner electrodes are stacked; and a plurality of gap layers, wherein the plurality of gap layers are formed so as not to contact external electrodes formed at both sides of the body, and a gap composition of the multilayered power inductor. In addition, as the gap composition, the exemplary embodiment of present invention can prepare tetravalent or tetravalent dielectric oxide into the paste type and applies the gap layer structure thereto, thereby facilitating the structural design and the thickness control of the gap layer as compared with the case of forming the gap layer in the sheet shape of the related art and improving the DC-bias characteristics by maximally suppressing the diffusion with the body.

Gap composition of multi layered power inductor and multi layered power inductor including gap layer using the same

Disclosed herein is a multilayer coil component, in which a copper-nickel mixture is used for an internal electrode, to form a nickel and ferrite mixed region at an interface between the internal electrode layer and a ceramic layer, thereby interrupting contact between the ceramic layer and the internal electrode, so that insulation resistance, which may be generated between the two materials can be increased and thus the deterioration in the characteristics of the multilayer coil component can be prevented.

Multilayer coil component

Disclosed herein are a ferrite composition for a high frequency bead in that a part of Fe in M-type hexagonal ferrite represented by BaFeOis substituted with at least one metal selected from a group consisting of 2-valence, 3-valence and 4-valence metals, as well as a chip bead material using the same. According to embodiments of the present invention, the dielectric composition is characterized in that a part of Fe as a constituent of M-type hexagonal barium ferrite is substituted by other metals, to thus decrease a sintering temperature to 920&#xb0; C. or less without using any additive for low temperature sintering. Moreover, because of high SRF properties, the inventive composition is applicable to a multilayer type chip bead used at a high frequency of more than several hundreds MHz and a magnetic antenna.

Ferrite composition for high frequency bead and chip bead comprising the same

Disclosed herein are a multilayer type inductor including a magnetic layer composition including NiZn ferrite, a multilayer type coil component including a magnetic layer prepared therefrom, and a method for manufacturing the same. According to the present invention, a copper electrode can be used as an internal electrode of a multilayer type coil product, by including NiZn ferrite in the magnetic layer. As copper is used for the internal electrode, material costs can be significantly reduced. Furthermore, the present invention can improve the maximum saturation magnetization value against the NiCuZn ferrite by about 10%, due to exclusion of Cu having weak magnetism, and can be more desirably used in a product employing high current.

Magnetic layer composition, multilayer type coil component, and method for manufacturing the same

Disclosed herein is a multilayer type power inductor including: a plurality of body layers including internal electrodes and having magnetic material layers stacked therein; and a plurality of gap layers, wherein the gap layer has an asymmetrical structure. In the multilayer type power inductor, portions that are in contact with the body layers have, a non-porous structure, which is a dense structure, and portions that are not in contact with the body layers have a porous structure, such that the gap layer has the asymmetrical structure. Therefore, a magnetic flux propagation path in a coil is dispersed to suppress magnetization at a high current, thereby making it possible to improve a change in inductance (L) value according to the application of current.

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Suwon-si, South Korea

So Yeon Song