Infineon Technologies Ag

Snezana Jenei

Hans-Joachim Barth

Oliver Nagy

Christian Cornelius Russ

Christian Pacha

Bernd Adler

Heinrich Koerner

Klaus Schruefer

Andre Hanke

Jiro Morinaga

Thorsten Meyer

Wolfgang Werner

Markus Brunnbauer

Christian Peters

Uwe Hodel

Robert Allinger

Klaus Knobloch

Martin Stiftinger

A method for applying a magnetic shielding layer to a substrate is provided, wherein a first magnetic shielding layer is adhered to a first surface of the substrate. A first film layer is adhered to the first magnetic shielding layer and the first magnetic shielding layer is more adherent to the first surface than the film layer to the first magnetic shielding layer.

Method for applying magnetic shielding layer, method for manufacturing a die, die and system

Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.

System on a chip with on-chip RF shield

In an embodiment, an apparatus includes a source region, a gate region and a drain region supported by a substrate, and a drift region including a plurality of vertically extending n-wells and p-wells to couple the gate region and the drain region of a transistor, wherein the plurality of n-wells and p-wells are formed in alternating longitudinal rows to form a superjunction drift region longitudinally extending between the gate region and the drain region of the transistor.

Integrated circuit using a superjunction semiconductor device

Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus.

Vertical diode using silicon formed by selective epitaxial growth

Embodiments relate to a bipolar transistor that includes a body region having a fin structure. At least one terminal region may be formed over at least a portion of the body region. The at least one terminal region may be formed as an epitaxially grown region. Embodiments also relate to a vertically integrated electronic device that includes a first terminal region, a second terminal region and a third terminal region. The second terminal region may be arranged over at least a portion of the third terminal region, and at least two of the first, second and third terminal regions may be formed as epitaxially grown regions.

Electronic device and manufacturing method thereof

A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution lines disposed above the system on chip, the first redistribution lines coupled to I/O connection nodes. The system on chip further includes second redistribution lines disposed above the RF component, the second redistribution lines coupled to ground potential nodes. The second redistribution lines include a first set of parallel metal lines coupled together by a second set of parallel metal lines.

On-chip RF shields with front side redistribution lines

Growing community of inventors

Munich, Germany

Snezana Jenei