Lam Research Corporation

Siva Krishnan Kanakasabapathy

Jengyi Yu

Seongjun Heo

Ge Yuan

Bart Jan Van Schravendijk

Girish Anant Dixit

Samantha SiamHwa Tan

Akhil N Singhal

Samantha Siamhwa Tan

David C Smith

In some examples, a method of processing a substrate comprises applying a photoresist (PR) onto a surface of the substrate, pre-exposing the PR to ultra violet (UV) light before depositing or etching a metal oxide (MO) layer onto the PR, and depositing or etching a MO layer onto the PR subsequent to pre-exposing the PR to UV light.

Bubble defect reduction

A method for cleaning surfaces of a substrate processing chamber includes a) supplying a first gas selected from a group consisting of silicon tetrachloride (SiCl), carbon tetrachloride (CCl), a hydrocarbon (CHwhere x and y are integers) and molecular chlorine (Cl), boron trichloride (BCl), and thionyl chloride (SOCl); b) striking plasma in the substrate processing chamber to etch the surfaces of the substrate processing chamber; c) extinguishing the plasma and evacuating the substrate processing chamber; d) supplying a second gas including fluorine species; e) striking plasma in the substrate processing chamber to etch the surfaces of the substrate processing chamber; and f) extinguishing the plasma and evacuating the substrate processing chamber.

Removing metal contamination from surfaces of a processing chamber

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Pleasanton, CA, United States of America

Siva Krishnan Kanakasabapathy