Alpha Assembly Solutions Inc.

Siuli Sarkar

Bawa Singh

Nitin Vithalbhai Desai

Oscar Khaselev

Ranjit Pandher

Rahul Raut

Monnir Boureghda

Anna Lifton

Ravindra Mohan Bhatkal

Anubhav Rustogi

Ravi Bhatkal

Shamik Ghoshal

Poulami Sengupta Roy

Carl Bilgrien

Morgana De Avila Ribas

Narahari Pujari

Nirmalya Kumar Chaki

Anil Kumar

Gyan Dutt

Shamik Ghosal

Venodh Manoharan

Nirmalyakumar Chaki

Niveditha Nagarajan

Remya Chandran

Proloy Nandi

Kamanio Chattopadhyay

Ashok Pachamuthu

Dominic Lodge

Morgana Ribas

Sutapa Mukherjee

Sathish Kumar

Ramakrishna Hosur Venkatagiriyappa

Pavan Vishwanath

Harish Hanchina Siddappa

Barun Das

Sujatha Chegudi

Anil K N Kumar

Daniel Goswami

Pritha Choudhury

Rohan P Setna

A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

Stretchable interconnects for flexible electronic surfaces

A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.

Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications

A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.

Lead-free solder compositions

Low pressure sintering powder

A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

Nano copper paste and film for sintered die attach and similar applications

Growing community of inventors

Waterbury, CT, United States of America

Siuli Sarkar