Alpha Assembly Solutions Inc.

Other

Macdermid Autotype Limited

Fry's Metals, Inc.

Alpha Metals, Inc.

Alpha Assembly Solution Inc.

Siuli Sarkar

Bawa Singh

Sutapa Mukherjee

Ranjit Pandher

Rahul Raut

Narahari Pujari

Morgana De Avila Ribas

Nirmalya Kumar Chaki

Ravi Bhatkal

Anubhav Rustogi

Ravindra Mohan Bhatkal

Nitin Vithalbhai Desai

Oscar Khaselev

Anna Lifton

Pritha Choudhury

Remya Chandran

Shamik Ghoshal

Pavan Vishwanath

Michael T Marczi

Brian Lewis

Michael James Liberatore

Sathish Kumar

Monnir Boureghda

Sanyogita Arora

Keith Paul Parsons

Barun Das

Poulami Sengupta Roy

Supriya Devarajan

Anna Jane Harris

Sachin Parashar

Ramakrishna Hosur Venkatagiriyappa

Ashok Pachamuthu

Harish Hanchina Siddappa

Shamik Ghosal

Jeffrey William Braham

Jayaprakash Sundaramurthy

Anil Kv Kumar

Chetan Pravinchandra Shah

Anil K N Kumar

Ramakrishna Hosur Katagiriyappa

Shu Tai Yong

Traian Cornel Cucu

Morgana Ribas

Daniel Goswami

Suresh Telu

V Sathish Kumar

Amit Patel

Nicholas G Herrick

Michael Liberatore

Anilkumar KN

This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures

The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

Dielectric ink composition

A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

Stretchable interconnects for flexible electronic surfaces

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

Advanced solder alloys for electronic interconnects

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Sintering materials and attachment methods using same

A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

Sintering paste

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

Lead-free and antimony-free tin solder reliable at high temperatures

Low pressure sintering powder

A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.

Multilayered metal nano and micron particles

Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150&#xb0; C., for example up to 175&#xb0; C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn&#x2014;Ag&#x2014;Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.

High reliability lead-free solder alloy

A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein:

Engineered polymer-based electronic materials

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Bengaluru, India

Siuli Sarkar