Asm Assembly Automation Limited

Siu Yan Ho

Gary Peter Widdowson

Wai Chuen Gan

Wing Cheung Ho

Hon Yu Peter Ng

Shiqiang Yao

Hon Shing Law

Chun Ho Ho

Siu Wai Chung

Chi Chung Mok

A linear switched reluctance motor comprises a movable coil bracket including first and second coil assemblies. Each of the first and second coil assemblies further comprises a plurality of coils separately wound around a plurality of motor coil cores, each of the coils being configured to receive a sinusoidal current at a different phase from other coils comprised in the same coil assembly. Tooth members of a stator track are located adjacent to the motor coil cores such that a magnetic flux path is created which passes through the motor coil core, the stator track and an air gap between the motor coil core and the stator track. A multiple-phase motor driver electrically connected to the first and second coil assemblies generates symmetric multiple-phase sinusoidal currents for driving the motor.

Multiple-phase linear switched reluctance motor

A driving mechanism comprises a fixed housing, a movable housing on which an object to be driven is mounted and a driving motor which is operative to drive the movable housing to move linearly as well as to rotate relative to the fixed housing. An inductance-type encoder determines both linear and rotary displacement of the movable housing relative to the fixed housing, whereby to provide closed-loop control of the position of the object in both linear and rotary directions.

Driving mechanism having position encoder for two-dimensional positioning

Wedge wire bonding apparatus are disclosed with an improved configuration in which the transducer axis lies on a line that bisects the XY axes, and the operator views the bonding process by looking directly along the axis of the transducer. The result is a shorter bonding cycle time as time is saved as the bonding head moves from a first to a second bonding position while at the same time the operator is placed in the best possible position for viewing the bonding operation, which facilitates in particular any necessary alignment and set-up steps.

Wire-bonding apparatus with improved XY-table orientation

The present invention provides a bonding head for a wedge wire bonding apparatus in which the bonding force of the transducer assembly, and also the clamping force of the wire clamping assembly are provided by permanent magnet motors including a coil formed as part of the transducer assembly and the wire clamping assembly respectively and with the coils located between magnets fixed to a bond head bracket member. The use of permanent magnet motors to provide the bonding and clamping forces results in apparatus in which the bonding and clamping forces can be controlled with high accuracy and reliability.

Growing community of inventors

Hong Kong, China

Siu Yan Ho